Conformal single-layer encapsulation of PEDOT at low substrate temperature

In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, pol...

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Main Authors: Chen, Nan, Wang, Xiaoxue, Gleason, Karen K
Other Authors: Massachusetts Institute of Technology. Department of Chemical Engineering
Format: Article
Language:en_US
Published: Elsevier 2017
Online Access:http://hdl.handle.net/1721.1/106566
https://orcid.org/0000-0002-5520-2473
https://orcid.org/0000-0001-6127-1056
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author Chen, Nan
Wang, Xiaoxue
Gleason, Karen K
author2 Massachusetts Institute of Technology. Department of Chemical Engineering
author_facet Massachusetts Institute of Technology. Department of Chemical Engineering
Chen, Nan
Wang, Xiaoxue
Gleason, Karen K
author_sort Chen, Nan
collection MIT
description In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, poly(divinylbenzene-co-maleic anhydride) (PDVB-MA), was first time synthesized via vapor phase process. This cross-linked iCVD polymer can be rapidly deposited (40 nm min−1) with uniform and conformal morphology. In the test of PEDOT degradation, the encapsulation extended the halflife of PEDOT to 900 h at 30 °C in air, which is more than 10 times of the counterpart without encapsulation.
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spelling mit-1721.1/1065662022-10-01T20:09:11Z Conformal single-layer encapsulation of PEDOT at low substrate temperature Chen, Nan Wang, Xiaoxue Gleason, Karen K Massachusetts Institute of Technology. Department of Chemical Engineering Gleason, Karen K. Chen, Nan Wang, Xiaoxue Gleason, Karen K In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, poly(divinylbenzene-co-maleic anhydride) (PDVB-MA), was first time synthesized via vapor phase process. This cross-linked iCVD polymer can be rapidly deposited (40 nm min−1) with uniform and conformal morphology. In the test of PEDOT degradation, the encapsulation extended the halflife of PEDOT to 900 h at 30 °C in air, which is more than 10 times of the counterpart without encapsulation. Eni S.p.A. (Firm) (Eni-MIT Solar Frontiers Alliance) 2017-01-20T19:29:36Z 2017-01-20T19:29:36Z 2014-06 2014-06 Article http://purl.org/eprint/type/JournalArticle 01694332 1873-5584 http://hdl.handle.net/1721.1/106566 Chen, Nan, Xiaoxue Wang, and Karen K. Gleason. “Conformal Single-Layer Encapsulation of PEDOT at Low Substrate Temperature.” Applied Surface Science 323 (December 2014): 2-6. https://orcid.org/0000-0002-5520-2473 https://orcid.org/0000-0001-6127-1056 en_US http://dx.doi.org/10.1016/j.apsusc.2014.06.123 Applied Surface Science Creative Commons Attribution-NonCommercial-NoDerivs License http://creativecommons.org/licenses/by-nc-nd/4.0/ application/pdf Elsevier Prof. Gleason via Erja Kajosalo
spellingShingle Chen, Nan
Wang, Xiaoxue
Gleason, Karen K
Conformal single-layer encapsulation of PEDOT at low substrate temperature
title Conformal single-layer encapsulation of PEDOT at low substrate temperature
title_full Conformal single-layer encapsulation of PEDOT at low substrate temperature
title_fullStr Conformal single-layer encapsulation of PEDOT at low substrate temperature
title_full_unstemmed Conformal single-layer encapsulation of PEDOT at low substrate temperature
title_short Conformal single-layer encapsulation of PEDOT at low substrate temperature
title_sort conformal single layer encapsulation of pedot at low substrate temperature
url http://hdl.handle.net/1721.1/106566
https://orcid.org/0000-0002-5520-2473
https://orcid.org/0000-0001-6127-1056
work_keys_str_mv AT chennan conformalsinglelayerencapsulationofpedotatlowsubstratetemperature
AT wangxiaoxue conformalsinglelayerencapsulationofpedotatlowsubstratetemperature
AT gleasonkarenk conformalsinglelayerencapsulationofpedotatlowsubstratetemperature