Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes
We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membran...
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| Format: | Article |
| Language: | en_US |
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Institute of Electrical and Electronics Engineers (IEEE)
2017
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| Online Access: | http://hdl.handle.net/1721.1/112125 https://orcid.org/0000-0002-5938-717X https://orcid.org/0000-0002-5042-4819 https://orcid.org/0000-0002-8974-756X https://orcid.org/0000-0003-4165-4732 https://orcid.org/0000-0003-0550-1739 https://orcid.org/0000-0001-8643-9281 https://orcid.org/0000-0001-7045-1200 |
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| author | Salamon, Todd R. Narayanan, Shankar Simon, Maria E. Lu, Zhengmao Bagnall, Kevin R. Hanks, Daniel Frank Antao, Dion Savio Barabadi, Banafsheh Sircar, Jay Wang, Evelyn |
| author2 | Lincoln Laboratory |
| author_facet | Lincoln Laboratory Salamon, Todd R. Narayanan, Shankar Simon, Maria E. Lu, Zhengmao Bagnall, Kevin R. Hanks, Daniel Frank Antao, Dion Savio Barabadi, Banafsheh Sircar, Jay Wang, Evelyn |
| author_sort | Salamon, Todd R. |
| collection | MIT |
| description | We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid flow in the device were modeled to determine the effect of different geometric parameters. With the optimization of various parameters, the device can achieve a heat transfer coefficient in excess of 0.05 kW/cm²-K, while dissipating a heat flux of 1 kW/cm². When applied to power electronics, such as GaN high-electron-mobility transistors, this membrane-based evaporative cooling device can lower the near-junction temperature by more than 40 K compared with contemporary single-phase microchannel coolers. |
| first_indexed | 2024-09-23T13:40:46Z |
| format | Article |
| id | mit-1721.1/112125 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T13:40:46Z |
| publishDate | 2017 |
| publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| record_format | dspace |
| spelling | mit-1721.1/1121252022-09-28T15:29:48Z Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes Salamon, Todd R. Narayanan, Shankar Simon, Maria E. Lu, Zhengmao Bagnall, Kevin R. Hanks, Daniel Frank Antao, Dion Savio Barabadi, Banafsheh Sircar, Jay Wang, Evelyn Lincoln Laboratory Massachusetts Institute of Technology. Department of Mechanical Engineering Wang, Evelyn N. Lu, Zhengmao Bagnall, Kevin R. Hanks, Daniel Frank Antao, Dion Savio Barabadi, Banafsheh Sircar, Jay Wang, Evelyn We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid flow in the device were modeled to determine the effect of different geometric parameters. With the optimization of various parameters, the device can achieve a heat transfer coefficient in excess of 0.05 kW/cm²-K, while dissipating a heat flux of 1 kW/cm². When applied to power electronics, such as GaN high-electron-mobility transistors, this membrane-based evaporative cooling device can lower the near-junction temperature by more than 40 K compared with contemporary single-phase microchannel coolers. 2017-11-02T18:27:43Z 2017-11-02T18:27:43Z 2016-07 2016-06 Article http://purl.org/eprint/type/JournalArticle 2156-3950 2156-3985 http://hdl.handle.net/1721.1/112125 Lu, Zhengmao, Todd R. Salamon, Shankar Narayanan, Kevin R. Bagnall, Daniel F. Hanks, Dion S. Antao, Banafsheh Barabadi, Jay Sircar, Maria E. Simon, and Evelyn N. Wang. “Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes.” IEEE Transactions on Components, Packaging and Manufacturing Technology 6, 7 (July 2016): 1056–1065 © 2016 Institute of Electrical and Electronics Engineers (IEEE) https://orcid.org/0000-0002-5938-717X https://orcid.org/0000-0002-5042-4819 https://orcid.org/0000-0002-8974-756X https://orcid.org/0000-0003-4165-4732 https://orcid.org/0000-0003-0550-1739 https://orcid.org/0000-0001-8643-9281 https://orcid.org/0000-0001-7045-1200 en_US http://dx.doi.org/10.1109/TCPMT.2016.2576998 IEEE Transactions on Components Packaging and Manufacturing Technology Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/pdf Institute of Electrical and Electronics Engineers (IEEE) Wang |
| spellingShingle | Salamon, Todd R. Narayanan, Shankar Simon, Maria E. Lu, Zhengmao Bagnall, Kevin R. Hanks, Daniel Frank Antao, Dion Savio Barabadi, Banafsheh Sircar, Jay Wang, Evelyn Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes |
| title | Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes |
| title_full | Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes |
| title_fullStr | Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes |
| title_full_unstemmed | Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes |
| title_short | Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes |
| title_sort | design and modeling of membrane based evaporative cooling devices for thermal management of high heat fluxes |
| url | http://hdl.handle.net/1721.1/112125 https://orcid.org/0000-0002-5938-717X https://orcid.org/0000-0002-5042-4819 https://orcid.org/0000-0002-8974-756X https://orcid.org/0000-0003-4165-4732 https://orcid.org/0000-0003-0550-1739 https://orcid.org/0000-0001-8643-9281 https://orcid.org/0000-0001-7045-1200 |
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