Substrate-blind photonic integration based on high-index glass materials
Conventional photonic integration technologies are inevitably substrate-dependent, as different substrate platforms stipulate vastly different device fabrication methods and processing compatibility requirements. Here we capitalize on the unique monolithic integration capacity of composition-enginee...
| Main Authors: | , , , , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
SPIE
2017
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| Online Access: | http://hdl.handle.net/1721.1/112199 https://orcid.org/0000-0002-1424-356X https://orcid.org/0000-0002-7233-3918 |
| Summary: | Conventional photonic integration technologies are inevitably substrate-dependent, as different substrate platforms stipulate vastly different device fabrication methods and processing compatibility requirements. Here we capitalize on the unique monolithic integration capacity of composition-engineered non-silicate glass materials (amorphous chalcogenides and transition metal oxides) to enable multifunctional, multi-layer photonic integration on virtually any technically important substrate platforms. We show that high-index glass film deposition and device fabrication can be performed at low temperatures ( < 250 °C) without compromising their low loss characteristics, and is thus fully compatible with monolithic integration on a broad range of substrates including semiconductors, plastics, textiles, and metals. Application of the technology is highlighted through three examples: demonstration of high-performance mid-IR photonic sensors on fluoride crystals, direct fabrication of photonic structures on graphene, and 3-D photonic integration on flexible plastic substrates. |
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