Effect of multi-field plates on the reverse breakdown and leakage characteristics of GaN-on-silicon HEMTs

MACOM Technology Solutions has a continuing joint development efforts sponsored by the Department of Energy with MIT main campus and MIT Lincoln Laboratory to develop GaN on silicon three terminal high voltage/high current switching devices. The initial developmental goals were for a three terminal...

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Bibliographic Details
Main Authors: Boles, T., Carlson, D., Xia, L., Kaleta, A., McLean, C., Jin, D., Palacios, Tomas, Turner, George W., Molnar, Richard J.
Other Authors: Lincoln Laboratory
Format: Article
Language:en_US
Published: 2018
Online Access:http://hdl.handle.net/1721.1/116103
https://orcid.org/0000-0002-2190-563X
Description
Summary:MACOM Technology Solutions has a continuing joint development efforts sponsored by the Department of Energy with MIT main campus and MIT Lincoln Laboratory to develop GaN on silicon three terminal high voltage/high current switching devices. The initial developmental goals were for a three terminal structure that has a reverse breakdown characteristic of >1200 volts and is capable of switching 10 amperes of current, with a current breakdown target of 3000 volts. This paper presents an update on the progress of this multi-year development project against these on-state current handling, reverse leakage and breakdown goals.