Microjet impingement cooling of high power-density electronics

Microjet impingement cooling of high power-density electronics

Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018.

Bibliographic Details
Main Author: Walsh, Stephen Michael, Ensign
Other Authors: Bernard A. Malouin Jr. and Evelyn N. Wang.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2018
Subjects:
Mechanical Engineering.
Online Access:http://hdl.handle.net/1721.1/118677

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