Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing
Dip pen nanolithography (DPN) is a flexible nanofabrication process for creating 2-D nanoscale features on a surface using an “inked” tip. Although a variety of ink-surface combinations can be used for creating 2-D nanofeatures using DPN, the process has not yet been characterized for high throughpu...
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| Format: | Article |
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ASME International
2018
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| Online Access: | http://hdl.handle.net/1721.1/119131 https://orcid.org/0000-0002-8014-1940 |
| _version_ | 1826189949056057344 |
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| author | Saha, Sourabh Kumar Culpepper, Martin |
| author2 | Massachusetts Institute of Technology. Department of Mechanical Engineering |
| author_facet | Massachusetts Institute of Technology. Department of Mechanical Engineering Saha, Sourabh Kumar Culpepper, Martin |
| author_sort | Saha, Sourabh Kumar |
| collection | MIT |
| description | Dip pen nanolithography (DPN) is a flexible nanofabrication process for creating 2-D nanoscale features on a surface using an “inked” tip. Although a variety of ink-surface combinations can be used for creating 2-D nanofeatures using DPN, the process has not yet been characterized for high throughput and high quality manufacturing. Therefore, at present it is not possible to (i) predict whether fabricating a part is feasible within the constraints of the desired rate and quality and (ii) select/design equipment appropriate for the desired manufacturing goals. Herein, we have quantified the processing rate, tool life, and feature quality for DPN line writing by linking these manufacturing metrics to the process/system parameters. Based on this characterization, we found that (i) due to theoretical and practical constraints of current technology, the processing rate cannot be increased beyond about 20 times the typical rate of ∼1 μm2 /min, (ii) tool life for accurate line writing is limited to 1–5 min, and (iii) sensitivity of line width to process parameters decreases with an increase in the writing speed. Thus, we conclude that for a high throughput and high quality system, we need (i) parallelization or process modification to improve throughput and (ii) accurate fixtures for rapid tool change. We also conclude that process control at high speed writing is less stringent than at low speed writing, thereby suggesting that DPN has a niche in high speed writing of narrow lines. |
| first_indexed | 2024-09-23T08:31:46Z |
| format | Article |
| id | mit-1721.1/119131 |
| institution | Massachusetts Institute of Technology |
| last_indexed | 2024-09-23T08:31:46Z |
| publishDate | 2018 |
| publisher | ASME International |
| record_format | dspace |
| spelling | mit-1721.1/1191312022-09-23T12:49:39Z Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing Saha, Sourabh Kumar Culpepper, Martin Massachusetts Institute of Technology. Department of Mechanical Engineering Massachusetts Institute of Technology. Laboratory for Manufacturing and Productivity Saha, Sourabh Kumar Culpepper, Martin Dip pen nanolithography (DPN) is a flexible nanofabrication process for creating 2-D nanoscale features on a surface using an “inked” tip. Although a variety of ink-surface combinations can be used for creating 2-D nanofeatures using DPN, the process has not yet been characterized for high throughput and high quality manufacturing. Therefore, at present it is not possible to (i) predict whether fabricating a part is feasible within the constraints of the desired rate and quality and (ii) select/design equipment appropriate for the desired manufacturing goals. Herein, we have quantified the processing rate, tool life, and feature quality for DPN line writing by linking these manufacturing metrics to the process/system parameters. Based on this characterization, we found that (i) due to theoretical and practical constraints of current technology, the processing rate cannot be increased beyond about 20 times the typical rate of ∼1 μm2 /min, (ii) tool life for accurate line writing is limited to 1–5 min, and (iii) sensitivity of line width to process parameters decreases with an increase in the writing speed. Thus, we conclude that for a high throughput and high quality system, we need (i) parallelization or process modification to improve throughput and (ii) accurate fixtures for rapid tool change. We also conclude that process control at high speed writing is less stringent than at low speed writing, thereby suggesting that DPN has a niche in high speed writing of narrow lines. National Science Foundation (U.S.) (Grant No. 0914790) 2018-11-15T20:40:47Z 2018-11-15T20:40:47Z 2011-07 2011-06 2018-11-09T14:25:12Z Article http://purl.org/eprint/type/JournalArticle 10871357 http://hdl.handle.net/1721.1/119131 Saha, Sourabh K., and Martin L. Culpepper. “Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing.” Journal of Manufacturing Science and Engineering 133, no. 4 (2011): 041005. © 2011 by ASME https://orcid.org/0000-0002-8014-1940 http://dx.doi.org/10.1115/1.4004406 Journal of Manufacturing Science and Engineering Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. application/pdf ASME International ASME |
| spellingShingle | Saha, Sourabh Kumar Culpepper, Martin Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing |
| title | Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing |
| title_full | Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing |
| title_fullStr | Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing |
| title_full_unstemmed | Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing |
| title_short | Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing |
| title_sort | characterization of the dip pen nanolithography process for nanomanufacturing |
| url | http://hdl.handle.net/1721.1/119131 https://orcid.org/0000-0002-8014-1940 |
| work_keys_str_mv | AT sahasourabhkumar characterizationofthedippennanolithographyprocessfornanomanufacturing AT culpeppermartin characterizationofthedippennanolithographyprocessfornanomanufacturing |