COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES
Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in satellites, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO₂ reduction, thermoelectric energy...
Main Authors: | , , |
---|---|
Other Authors: | |
Format: | Article |
Published: |
Begell House
2018
|
Online Access: | http://hdl.handle.net/1721.1/119206 https://orcid.org/0000-0002-3968-8530 |
_version_ | 1826194318840299520 |
---|---|
author | Tian, Zhiting Lee, Sangyeop Chen, Gang |
author2 | Massachusetts Institute of Technology. Department of Mechanical Engineering |
author_facet | Massachusetts Institute of Technology. Department of Mechanical Engineering Tian, Zhiting Lee, Sangyeop Chen, Gang |
author_sort | Tian, Zhiting |
collection | MIT |
description | Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in satellites, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO₂ reduction, thermoelectric energy conversion has been receiving intensified attention as a potential candidate for waste- heat harvesting as well as for power generation from renewable sources. Efficient thermoelectric energy con version critically depends on the performance of thermoelectric materials and devices. In this review, we discuss heat transfer in thermoelectric materials and devices, especially phonon engineering to reduce the lattice thermal conductivity of thermoelec tric materials, which requires a fundamental understanding of nanoscale heat conduction physics. |
first_indexed | 2024-09-23T09:53:52Z |
format | Article |
id | mit-1721.1/119206 |
institution | Massachusetts Institute of Technology |
last_indexed | 2024-09-23T09:53:52Z |
publishDate | 2018 |
publisher | Begell House |
record_format | dspace |
spelling | mit-1721.1/1192062022-09-26T14:26:15Z COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES Tian, Zhiting Lee, Sangyeop Chen, Gang Massachusetts Institute of Technology. Department of Mechanical Engineering Tian, Zhiting Lee, Sangyeop Chen, Gang Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in satellites, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO₂ reduction, thermoelectric energy conversion has been receiving intensified attention as a potential candidate for waste- heat harvesting as well as for power generation from renewable sources. Efficient thermoelectric energy con version critically depends on the performance of thermoelectric materials and devices. In this review, we discuss heat transfer in thermoelectric materials and devices, especially phonon engineering to reduce the lattice thermal conductivity of thermoelec tric materials, which requires a fundamental understanding of nanoscale heat conduction physics. United States. Department of Energy. Office of Basic Energy Science (Award Number DE - FG02 - 09ER46577) OSU MURI (Award Number RF01224242) 2018-11-19T19:21:12Z 2018-11-19T19:21:12Z 2014-01 2018-11-07T13:44:45Z Article http://purl.org/eprint/type/JournalArticle 1049-0787 http://hdl.handle.net/1721.1/119206 Tian, Zhiting, Sangyeop Lee, and Gang Chen. “COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES.” Annual Review of Heat Transfer 17, no. N/A (2014): 425–483. https://orcid.org/0000-0002-3968-8530 http://dx.doi.org/10.1615/ANNUALREVHEATTRANSFER.2014006932 Annual Review of Heat Transfer Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/pdf Begell House arXiv |
spellingShingle | Tian, Zhiting Lee, Sangyeop Chen, Gang COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES |
title | COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES |
title_full | COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES |
title_fullStr | COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES |
title_full_unstemmed | COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES |
title_short | COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES |
title_sort | comprehensive review of heat transfer in thermoelectric materials and devices |
url | http://hdl.handle.net/1721.1/119206 https://orcid.org/0000-0002-3968-8530 |
work_keys_str_mv | AT tianzhiting comprehensivereviewofheattransferinthermoelectricmaterialsanddevices AT leesangyeop comprehensivereviewofheattransferinthermoelectricmaterialsanddevices AT chengang comprehensivereviewofheattransferinthermoelectricmaterialsanddevices |