Predicting solder defects in printed circuit board assembly (PCBA) process

Predicting solder defects in printed circuit board assembly (PCBA) process

Thesis: M.B.A., Massachusetts Institute of Technology, Sloan School of Management, 2019, In conjunction with the Leaders for Global Operations Program at MIT

Bibliographic Details
Main Author:	Foster, Andrew Wallace.
Other Authors:	Dr. Retsef Levi and John Williams.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2019
Subjects:	Sloan School of Management. Civil and Environmental Engineering. Leaders for Global Operations Program.
Online Access:	https://hdl.handle.net/1721.1/122584

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