A software pipeline for converting 3D models into 3D breadboards

Thesis: S.M. in Computer Science and Engineering, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2019

Bibliographic Details
Main Author: Zhu, Junyi,S.M.Massachusetts Institute of Technology.
Other Authors: Stefanie Mueller.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2019
Subjects:
Online Access:https://hdl.handle.net/1721.1/122732
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author Zhu, Junyi,S.M.Massachusetts Institute of Technology.
author2 Stefanie Mueller.
author_facet Stefanie Mueller.
Zhu, Junyi,S.M.Massachusetts Institute of Technology.
author_sort Zhu, Junyi,S.M.Massachusetts Institute of Technology.
collection MIT
description Thesis: S.M. in Computer Science and Engineering, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2019
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spelling mit-1721.1/1227322019-11-22T03:38:47Z A software pipeline for converting 3D models into 3D breadboards Software pipeline for converting three-dimensional models into three-dimensional breadboards Zhu, Junyi,S.M.Massachusetts Institute of Technology. Stefanie Mueller. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Electrical Engineering and Computer Science. Thesis: S.M. in Computer Science and Engineering, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2019 Cataloged from PDF version of thesis. Includes bibliographical references (pages 44-46). 3D breadboards are a new form of physical prototypes with breadboard functions directly integrated into its surfaces. 3D breadboards offer both the flexibility and re-configurability of breadboards, while also integrating well with the shape of the prototype. As a result, 3D breadboards can be used to test function directly in context of the actual physical form. Our custom 3D editor plugin supports designers in the process of converting 3D models into 3D breadboards. Our plugin first generates a pinhole pattern on the surface of the 3D model; designers can then connect the holes into power lines and terminal strips depending on the desired layout. To fabricate the 3D breadboards, designers only have to 3D print the housing and then fill the wire channels with conductive silicone. We explore a number of computational design and computer graphics approaches to convert arbitrary 3D models into 3D breadboards. We demonstrate a range of different interactive prototypes designed by our software system, and report on a user study with six participants to validate the concept of integrating breadboards into physical prototypes. by Junyi Zhu. S.M. in Computer Science and Engineering S.M.inComputerScienceandEngineering Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science 2019-11-04T20:21:33Z 2019-11-04T20:21:33Z 2019 2019 Thesis https://hdl.handle.net/1721.1/122732 1124679434 eng MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission. http://dspace.mit.edu/handle/1721.1/7582 46 pages application/pdf Massachusetts Institute of Technology
spellingShingle Electrical Engineering and Computer Science.
Zhu, Junyi,S.M.Massachusetts Institute of Technology.
A software pipeline for converting 3D models into 3D breadboards
title A software pipeline for converting 3D models into 3D breadboards
title_full A software pipeline for converting 3D models into 3D breadboards
title_fullStr A software pipeline for converting 3D models into 3D breadboards
title_full_unstemmed A software pipeline for converting 3D models into 3D breadboards
title_short A software pipeline for converting 3D models into 3D breadboards
title_sort software pipeline for converting 3d models into 3d breadboards
topic Electrical Engineering and Computer Science.
url https://hdl.handle.net/1721.1/122732
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