Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing
Automated handling of microscale objects is essential for manufacturing of next-generation electronic systems. Yet, mechanical pick-and-place technologies cannot manipulate smaller objects whose surface forces dominate over gravity, and emerging microtransfer printing methods require multidirectiona...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
American Association for the Advancement of Science (AAAS)
2020
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| Online Access: | https://hdl.handle.net/1721.1/124379 |
| _version_ | 1811082307756359680 |
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| author | Kim, Sanha Boutilier, Michael Stephen Hatcher Nayakanti, Nigamaa Cao, Changhong Jacob, Christine Zhao, Hangbo Hart, Anastasios John |
| author2 | Massachusetts Institute of Technology. Department of Mechanical Engineering |
| author_facet | Massachusetts Institute of Technology. Department of Mechanical Engineering Kim, Sanha Boutilier, Michael Stephen Hatcher Nayakanti, Nigamaa Cao, Changhong Jacob, Christine Zhao, Hangbo Hart, Anastasios John |
| author_sort | Kim, Sanha |
| collection | MIT |
| description | Automated handling of microscale objects is essential for manufacturing of next-generation electronic systems. Yet, mechanical pick-and-place technologies cannot manipulate smaller objects whose surface forces dominate over gravity, and emerging microtransfer printing methods require multidirectional motion, heating, and/or chemical bonding to switch adhesion. We introduce soft nanocomposite electroadhesives (SNEs), comprising sparse forests of dielectric-coated carbon nanotubes (CNTs), which have electrostatically switchable dry adhesion. SNEs exhibit 40-fold lower nominal dry adhesion than typical solids, yet their adhesion is increased >100-fold by applying 30 V to the CNTs. We characterize the scaling of adhesion with surface morphology, dielectric thickness, and applied voltage and demonstrate digital transfer printing of films of Ag nanowires, polymer and metal microparticles, and unpackaged light-emitting diodes. |
| first_indexed | 2024-09-23T12:01:03Z |
| format | Article |
| id | mit-1721.1/124379 |
| institution | Massachusetts Institute of Technology |
| language | English |
| last_indexed | 2024-09-23T12:01:03Z |
| publishDate | 2020 |
| publisher | American Association for the Advancement of Science (AAAS) |
| record_format | dspace |
| spelling | mit-1721.1/1243792022-09-27T23:32:14Z Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing Kim, Sanha Boutilier, Michael Stephen Hatcher Nayakanti, Nigamaa Cao, Changhong Jacob, Christine Zhao, Hangbo Hart, Anastasios John Massachusetts Institute of Technology. Department of Mechanical Engineering Automated handling of microscale objects is essential for manufacturing of next-generation electronic systems. Yet, mechanical pick-and-place technologies cannot manipulate smaller objects whose surface forces dominate over gravity, and emerging microtransfer printing methods require multidirectional motion, heating, and/or chemical bonding to switch adhesion. We introduce soft nanocomposite electroadhesives (SNEs), comprising sparse forests of dielectric-coated carbon nanotubes (CNTs), which have electrostatically switchable dry adhesion. SNEs exhibit 40-fold lower nominal dry adhesion than typical solids, yet their adhesion is increased >100-fold by applying 30 V to the CNTs. We characterize the scaling of adhesion with surface morphology, dielectric thickness, and applied voltage and demonstrate digital transfer printing of films of Ag nanowires, polymer and metal microparticles, and unpackaged light-emitting diodes. National Science Foundation (U.S.) (CMMI-1463181) Massachusetts Institute of Technology. Institute for Soldier Nanotechnologies (contract W911NF-13-D-0001) 2020-03-27T13:53:55Z 2020-03-27T13:53:55Z 2019-10 2020-02-14T18:24:13Z Article http://purl.org/eprint/type/JournalArticle 2375-2548 https://hdl.handle.net/1721.1/124379 Kim, Sanha et al. "Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing." Science advances 5 (2019): eaax4790 © 2019 The Author(s) en 10.1126/sciadv.aax4790 Science advances Creative Commons Attribution NonCommercial License 4.0 https://creativecommons.org/licenses/by-nc/4.0/ application/pdf American Association for the Advancement of Science (AAAS) Science Advances |
| spellingShingle | Kim, Sanha Boutilier, Michael Stephen Hatcher Nayakanti, Nigamaa Cao, Changhong Jacob, Christine Zhao, Hangbo Hart, Anastasios John Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing |
| title | Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing |
| title_full | Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing |
| title_fullStr | Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing |
| title_full_unstemmed | Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing |
| title_short | Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing |
| title_sort | soft nanocomposite electroadhesives for digital micro and nanotransfer printing |
| url | https://hdl.handle.net/1721.1/124379 |
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