Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1992 and Thesis (M.S)--Sloan School of Management, 1992.
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Format: | Thesis |
Language: | eng |
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Massachusetts Institute of Technology
2005
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Online Access: | http://hdl.handle.net/1721.1/12889 |
_version_ | 1811091477195915264 |
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author | Soederberg, Eric Martin |
author2 | John Kassakian and Anant Balakrishnan. |
author_facet | John Kassakian and Anant Balakrishnan. Soederberg, Eric Martin |
author_sort | Soederberg, Eric Martin |
collection | MIT |
description | Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1992 and Thesis (M.S)--Sloan School of Management, 1992. |
first_indexed | 2024-09-23T15:03:03Z |
format | Thesis |
id | mit-1721.1/12889 |
institution | Massachusetts Institute of Technology |
language | eng |
last_indexed | 2024-09-23T15:03:03Z |
publishDate | 2005 |
publisher | Massachusetts Institute of Technology |
record_format | dspace |
spelling | mit-1721.1/128892019-04-12T12:15:21Z Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly Soederberg, Eric Martin John Kassakian and Anant Balakrishnan. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science Sloan School of Management Electrical Engineering and Computer Science Sloan School of Management Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1992 and Thesis (M.S)--Sloan School of Management, 1992. Includes bibliographical references (p. 72-73). by Eric Martin Soederberg. M.S M.S. 2005-08-15T19:29:42Z 2005-08-15T19:29:42Z 1992 1992 Thesis http://hdl.handle.net/1721.1/12889 27828606 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 78 p. 5847950 bytes 5847708 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
spellingShingle | Electrical Engineering and Computer Science Sloan School of Management Soederberg, Eric Martin Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly |
title | Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly |
title_full | Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly |
title_fullStr | Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly |
title_full_unstemmed | Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly |
title_short | Using defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assembly |
title_sort | using defect data to characterize assembly process capabilities and constraints for printed circuit board design for assembly |
topic | Electrical Engineering and Computer Science Sloan School of Management |
url | http://hdl.handle.net/1721.1/12889 |
work_keys_str_mv | AT soederbergericmartin usingdefectdatatocharacterizeassemblyprocesscapabilitiesandconstraintsforprintedcircuitboarddesignforassembly |