Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects
Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/13114 |
| _version_ | 1811081348203413504 |
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| author | Longworth, Hai Pham |
| author2 | Carl V. Thompson. |
| author_facet | Carl V. Thompson. Longworth, Hai Pham |
| author_sort | Longworth, Hai Pham |
| collection | MIT |
| description | Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. |
| first_indexed | 2024-09-23T11:45:21Z |
| format | Thesis |
| id | mit-1721.1/13114 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T11:45:21Z |
| publishDate | 2005 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/131142019-04-11T08:43:21Z Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects Longworth, Hai Pham Carl V. Thompson. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Materials Science and Engineering Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. Includes bibliographical references (leaves 246-262). by Hai Pham Longworth. Sc.D. 2005-08-15T16:16:34Z 2005-08-15T16:16:34Z 1992 1992 Thesis http://hdl.handle.net/1721.1/13114 26408909 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 262 leaves 19103536 bytes 19103293 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Materials Science and Engineering Longworth, Hai Pham Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects |
| title | Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects |
| title_full | Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects |
| title_fullStr | Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects |
| title_full_unstemmed | Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects |
| title_short | Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects |
| title_sort | microstructural modification of thin films and its relation to the electromigration limited reliability of vlsi interconnects |
| topic | Materials Science and Engineering |
| url | http://hdl.handle.net/1721.1/13114 |
| work_keys_str_mv | AT longworthhaipham microstructuralmodificationofthinfilmsanditsrelationtotheelectromigrationlimitedreliabilityofvlsiinterconnects |