Toward Optimal Heat Transfer of 2D–3D Heterostructures via van der Waals Binding Effects

Toward Optimal Heat Transfer of 2D–3D Heterostructures via van der Waals Binding Effects

Two-dimensional (2D) materials and their heterogeneous integration have enabled promising electronic and photonic applications. However, significant thermal challenges arise due to numerous van der Waals (vdW) interfaces limiting the dissipation of heat generated in the device. In this work, we inve...

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Bibliographic Details
Main Authors: Zhang, Lenan, Zhong, Yang, Qian, Xin, Song, Qichen, Zhou, Jiawei, Li, Long, Guo, Liang, Chen, Gang, Wang, Evelyn N
Other Authors: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Article
Language:English
Published: American Chemical Society (ACS) 2022
Online Access:https://hdl.handle.net/1721.1/142058

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