Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering
Main Authors: | , , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
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Wiley
2022
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Online Access: | https://hdl.handle.net/1721.1/145738 |
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author | Kornbluth, Yosef S Parameswaran, Lalitha Mathews, Richard Racz, Livia M Velásquez-García, Luis F |
author2 | Massachusetts Institute of Technology. Microsystems Technology Laboratories |
author_facet | Massachusetts Institute of Technology. Microsystems Technology Laboratories Kornbluth, Yosef S Parameswaran, Lalitha Mathews, Richard Racz, Livia M Velásquez-García, Luis F |
author_sort | Kornbluth, Yosef S |
collection | MIT |
first_indexed | 2024-09-23T15:38:19Z |
format | Article |
id | mit-1721.1/145738 |
institution | Massachusetts Institute of Technology |
language | English |
last_indexed | 2024-09-23T15:38:19Z |
publishDate | 2022 |
publisher | Wiley |
record_format | dspace |
spelling | mit-1721.1/1457382022-10-08T03:05:57Z Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering Kornbluth, Yosef S Parameswaran, Lalitha Mathews, Richard Racz, Livia M Velásquez-García, Luis F Massachusetts Institute of Technology. Microsystems Technology Laboratories Lincoln Laboratory Massachusetts Institute of Technology. Department of Mechanical Engineering 2022-10-07T13:14:14Z 2022-10-07T13:14:14Z 2022 2022-10-07T12:58:34Z Article http://purl.org/eprint/type/JournalArticle https://hdl.handle.net/1721.1/145738 Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M and Velásquez-García, Luis F. 2022. "Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering." Advanced Materials Technologies, 7 (8). en 10.1002/ADMT.202200097 Advanced Materials Technologies Creative Commons Attribution 4.0 International license https://creativecommons.org/licenses/by/4.0/ application/pdf Wiley Wiley |
spellingShingle | Kornbluth, Yosef S Parameswaran, Lalitha Mathews, Richard Racz, Livia M Velásquez-García, Luis F Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering |
title | Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering |
title_full | Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering |
title_fullStr | Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering |
title_full_unstemmed | Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering |
title_short | Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering |
title_sort | fully 3d printed ultrathin capacitors via multi material microsputtering |
url | https://hdl.handle.net/1721.1/145738 |
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