Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Bibliographic Details
Main Authors: Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M, Velásquez-García, Luis F
Other Authors: Massachusetts Institute of Technology. Microsystems Technology Laboratories
Format: Article
Language:English
Published: Wiley 2022
Online Access:https://hdl.handle.net/1721.1/145738
_version_ 1826212813808336896
author Kornbluth, Yosef S
Parameswaran, Lalitha
Mathews, Richard
Racz, Livia M
Velásquez-García, Luis F
author2 Massachusetts Institute of Technology. Microsystems Technology Laboratories
author_facet Massachusetts Institute of Technology. Microsystems Technology Laboratories
Kornbluth, Yosef S
Parameswaran, Lalitha
Mathews, Richard
Racz, Livia M
Velásquez-García, Luis F
author_sort Kornbluth, Yosef S
collection MIT
first_indexed 2024-09-23T15:38:19Z
format Article
id mit-1721.1/145738
institution Massachusetts Institute of Technology
language English
last_indexed 2024-09-23T15:38:19Z
publishDate 2022
publisher Wiley
record_format dspace
spelling mit-1721.1/1457382022-10-08T03:05:57Z Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering Kornbluth, Yosef S Parameswaran, Lalitha Mathews, Richard Racz, Livia M Velásquez-García, Luis F Massachusetts Institute of Technology. Microsystems Technology Laboratories Lincoln Laboratory Massachusetts Institute of Technology. Department of Mechanical Engineering 2022-10-07T13:14:14Z 2022-10-07T13:14:14Z 2022 2022-10-07T12:58:34Z Article http://purl.org/eprint/type/JournalArticle https://hdl.handle.net/1721.1/145738 Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M and Velásquez-García, Luis F. 2022. "Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering." Advanced Materials Technologies, 7 (8). en 10.1002/ADMT.202200097 Advanced Materials Technologies Creative Commons Attribution 4.0 International license https://creativecommons.org/licenses/by/4.0/ application/pdf Wiley Wiley
spellingShingle Kornbluth, Yosef S
Parameswaran, Lalitha
Mathews, Richard
Racz, Livia M
Velásquez-García, Luis F
Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering
title Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering
title_full Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering
title_fullStr Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering
title_full_unstemmed Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering
title_short Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering
title_sort fully 3d printed ultrathin capacitors via multi material microsputtering
url https://hdl.handle.net/1721.1/145738
work_keys_str_mv AT kornbluthyosefs fully3dprintedultrathincapacitorsviamultimaterialmicrosputtering
AT parameswaranlalitha fully3dprintedultrathincapacitorsviamultimaterialmicrosputtering
AT mathewsrichard fully3dprintedultrathincapacitorsviamultimaterialmicrosputtering
AT raczliviam fully3dprintedultrathincapacitorsviamultimaterialmicrosputtering
AT velasquezgarcialuisf fully3dprintedultrathincapacitorsviamultimaterialmicrosputtering