Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Bibliographic Details
Main Authors:	Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M, Velásquez-García, Luis F
Other Authors:	Massachusetts Institute of Technology. Microsystems Technology Laboratories
Format:	Article
Language:	English
Published:	Wiley 2022
Online Access:	https://hdl.handle.net/1721.1/145738

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