Machine Learning Methods for Automated Macro-Inspection and Improved Defect Identification in Semiconductor Manufacturing
This thesis proposes four methods to improve macro-inspection capability of defects on wafers at a semiconductor wafer fab. First, an investigation into the performance of current inspection tools is done, revealing results that are not reliable nor reproducible. Tool maintenance procedures and spec...
Main Author: | Cheung, Sophia |
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Other Authors: | Boning, Duane |
Format: | Thesis |
Published: |
Massachusetts Institute of Technology
2023
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Online Access: | https://hdl.handle.net/1721.1/152700 |
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