The Effect of Joint Thickness on Intermetallic Growth in the In52Sn48(Liquid)/Cu(Solid) Diffusion Couple
Abstract Intermetallic growth can simultaneously enable low-resistance electrical pathways and determine the lifetime of a solder joint. Motivating this work is a demountable linear bilateral solder joint application, enabled via a vacuum pressure impregnation process. The effect of the...
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| Format: | Article |
| Language: | English |
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Springer US
2023
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| Online Access: | https://hdl.handle.net/1721.1/152964 |