Heat diffusion during thin-film composite membrane formation
Thin-film composite (TFC) membranes, the backbone of modern reverse osmosis and nanofiltration, combine the high separation performance of a thin selective layer with the robust mechanical support. Previous studies have shown that heat released during interfacial polymerization (IP) can have a signi...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Elsevier BV
2024
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| Online Access: | https://hdl.handle.net/1721.1/155271 |
| _version_ | 1811087905975697408 |
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| author | Deshmukh, Akshay Lienhard, John H. Elimelech, Menachem |
| author_facet | Deshmukh, Akshay Lienhard, John H. Elimelech, Menachem |
| author_sort | Deshmukh, Akshay |
| collection | MIT |
| description | Thin-film composite (TFC) membranes, the backbone of modern reverse osmosis and nanofiltration, combine the high separation performance of a thin selective layer with the robust mechanical support. Previous studies have shown that heat released during interfacial polymerization (IP) can have a significant impact on the physical and chemical structure of the selective layer. In this study, we develop a multilayer transient
heat conduction model to analyze how the thermal properties of the materials used in
TFC fabrication impact interfacial temperature, focusing on support-free (SFIP), conventional (CIP), and interlayer-modulated IP (IMIP). Using a combination of analytic
solutions and computational models, we demonstrate that the thermal effusivities of
fluid and material layers can have a significant effect on the temporal evolution of
interfacial temperature during IP. In CIP, we show that the presence of a polymeric
support adjacent to the reaction interface yields a 20% to 60% increase in interfacial
temperature rise, lasting for ∼ 0.1 s. Furthermore, we demonstrate that inorganic or
metallic interlayers, which have high thermal effusivities, can lead to short-lived orderof-magnitude reductions in interfacial temperature rise. Finally, we provide analytical
approximations for transient heat conduction through multilayered systems, enabling
rapid evaluation of the thermal impact of novel membrane support and interlayer materials and structures on interfacial temperature during TFC fabrication. Quantifying
how the thermal properties of solvents, support layers, and interlayers affect interfacial
temperature during IP is critical for the rational design of new TFC membranes. |
| first_indexed | 2024-09-23T13:53:28Z |
| format | Article |
| id | mit-1721.1/155271 |
| institution | Massachusetts Institute of Technology |
| language | English |
| last_indexed | 2024-09-23T13:53:28Z |
| publishDate | 2024 |
| publisher | Elsevier BV |
| record_format | dspace |
| spelling | mit-1721.1/1552712024-09-12T04:30:43Z Heat diffusion during thin-film composite membrane formation Deshmukh, Akshay Lienhard, John H. Elimelech, Menachem Thin-film composite (TFC) membranes, the backbone of modern reverse osmosis and nanofiltration, combine the high separation performance of a thin selective layer with the robust mechanical support. Previous studies have shown that heat released during interfacial polymerization (IP) can have a significant impact on the physical and chemical structure of the selective layer. In this study, we develop a multilayer transient heat conduction model to analyze how the thermal properties of the materials used in TFC fabrication impact interfacial temperature, focusing on support-free (SFIP), conventional (CIP), and interlayer-modulated IP (IMIP). Using a combination of analytic solutions and computational models, we demonstrate that the thermal effusivities of fluid and material layers can have a significant effect on the temporal evolution of interfacial temperature during IP. In CIP, we show that the presence of a polymeric support adjacent to the reaction interface yields a 20% to 60% increase in interfacial temperature rise, lasting for ∼ 0.1 s. Furthermore, we demonstrate that inorganic or metallic interlayers, which have high thermal effusivities, can lead to short-lived orderof-magnitude reductions in interfacial temperature rise. Finally, we provide analytical approximations for transient heat conduction through multilayered systems, enabling rapid evaluation of the thermal impact of novel membrane support and interlayer materials and structures on interfacial temperature during TFC fabrication. Quantifying how the thermal properties of solvents, support layers, and interlayers affect interfacial temperature during IP is critical for the rational design of new TFC membranes. 2024-06-13T20:30:51Z 2024-06-13T20:30:51Z 2024-03 2024-06-13T20:21:28Z Article http://purl.org/eprint/type/JournalArticle 0376-7388 https://hdl.handle.net/1721.1/155271 Deshmukh, Akshay, Lienhard, John H. and Elimelech, Menachem. 2024. "Heat diffusion during thin-film composite membrane formation." Journal of Membrane Science, 696. en 10.1016/j.memsci.2024.122493 Journal of Membrane Science Creative Commons Attribution-Noncommercial-ShareAlike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/pdf Elsevier BV Author |
| spellingShingle | Deshmukh, Akshay Lienhard, John H. Elimelech, Menachem Heat diffusion during thin-film composite membrane formation |
| title | Heat diffusion during thin-film composite membrane formation |
| title_full | Heat diffusion during thin-film composite membrane formation |
| title_fullStr | Heat diffusion during thin-film composite membrane formation |
| title_full_unstemmed | Heat diffusion during thin-film composite membrane formation |
| title_short | Heat diffusion during thin-film composite membrane formation |
| title_sort | heat diffusion during thin film composite membrane formation |
| url | https://hdl.handle.net/1721.1/155271 |
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