Application of Multi-Objective Genetic Optimization in PCB Component Placement

Designing a printed circuit board (PCB) is a complex process that involves creating a schematic, placing components, ensuring that every component is routable, and performing simulations to predict the behavior of the PCB before it is manufactured. With the rise of technological innovations, the dem...

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Bibliographic Details
Main Author: Ngô, Thomas
Other Authors: Daniel, Luca
Format: Thesis
Published: Massachusetts Institute of Technology 2024
Online Access:https://hdl.handle.net/1721.1/155911
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author Ngô, Thomas
author2 Daniel, Luca
author_facet Daniel, Luca
Ngô, Thomas
author_sort Ngô, Thomas
collection MIT
description Designing a printed circuit board (PCB) is a complex process that involves creating a schematic, placing components, ensuring that every component is routable, and performing simulations to predict the behavior of the PCB before it is manufactured. With the rise of technological innovations, the demand for chips will increase, putting pressure on the electronic design automation (EDA) industry to innovate in PCB design. As part of Cadence’s Allegro X AI team, which aims to develop AI technology to automate PCB designers’ tasks, we explored the application of multi-objective genetic optimization in component placements as an alternative method for automating component placement. More specifically, we applied genetic optimization to a two-sided printed circuit board (PCB). We discovered that employing multiple objectives, such as half-perimeter wirelength and routability, produces promising component placements.
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spelling mit-1721.1/1559112024-08-02T03:57:52Z Application of Multi-Objective Genetic Optimization in PCB Component Placement Ngô, Thomas Daniel, Luca Massachusetts Institute of Technology. Department of Brain and Cognitive Sciences Designing a printed circuit board (PCB) is a complex process that involves creating a schematic, placing components, ensuring that every component is routable, and performing simulations to predict the behavior of the PCB before it is manufactured. With the rise of technological innovations, the demand for chips will increase, putting pressure on the electronic design automation (EDA) industry to innovate in PCB design. As part of Cadence’s Allegro X AI team, which aims to develop AI technology to automate PCB designers’ tasks, we explored the application of multi-objective genetic optimization in component placements as an alternative method for automating component placement. More specifically, we applied genetic optimization to a two-sided printed circuit board (PCB). We discovered that employing multiple objectives, such as half-perimeter wirelength and routability, produces promising component placements. M.Eng. 2024-08-01T19:06:58Z 2024-08-01T19:06:58Z 2024-02 2024-07-11T15:29:37.019Z Thesis https://hdl.handle.net/1721.1/155911 Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) Copyright retained by author(s) https://creativecommons.org/licenses/by-nc-nd/4.0/ application/pdf Massachusetts Institute of Technology
spellingShingle Ngô, Thomas
Application of Multi-Objective Genetic Optimization in PCB Component Placement
title Application of Multi-Objective Genetic Optimization in PCB Component Placement
title_full Application of Multi-Objective Genetic Optimization in PCB Component Placement
title_fullStr Application of Multi-Objective Genetic Optimization in PCB Component Placement
title_full_unstemmed Application of Multi-Objective Genetic Optimization in PCB Component Placement
title_short Application of Multi-Objective Genetic Optimization in PCB Component Placement
title_sort application of multi objective genetic optimization in pcb component placement
url https://hdl.handle.net/1721.1/155911
work_keys_str_mv AT ngothomas applicationofmultiobjectivegeneticoptimizationinpcbcomponentplacement