An empirical study of manufacturing flexibility in printed-circuit board assembly

An empirical study of manufacturing flexibility in printed-circuit board assembly

Includes bibliographical references (p. 19-21).

Bibliographic Details
Other Authors: MIT Japan Program.
Language:eng
Published: MIT Japan Program, Massachusetts Institute of Technology 2005
Subjects:
Q180.J3 M22 no.92-11
Online Access:http://hdl.handle.net/1721.1/17106
Description
Summary:Includes bibliographical references (p. 19-21).

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