An empirical study of manufacturing flexibility in printed-circuit board assembly

Includes bibliographical references (p. 19-21).

Bibliographic Details
Other Authors: MIT Japan Program.
Language:eng
Published: MIT Japan Program, Massachusetts Institute of Technology 2005
Subjects:
Online Access:http://hdl.handle.net/1721.1/17106
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author_facet MIT Japan Program.
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description Includes bibliographical references (p. 19-21).
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institution Massachusetts Institute of Technology
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spelling mit-1721.1/171062019-04-11T03:49:36Z An empirical study of manufacturing flexibility in printed-circuit board assembly MIT Japan Program. Suárez, Fernando F., 1960- Cusumano, Michael A., 1954- Fine, Charles H Q180.J3 M22 no.92-11 Includes bibliographical references (p. 19-21). Funded by the Leaders for Manufacturing Program and the International Center for Research on the Management of Technology. Fernando F. Suarez, Michael A. Cusumano, and Charles F. Fine [i.e. Charles H. Fine]. 2005-06-01T15:19:24Z 2005-06-01T15:19:24Z 1992 92-11 http://hdl.handle.net/1721.1/17106 eng MITJP (Series) ; 92-11. 21, [12] p. 2972873 bytes application/pdf application/pdf MIT Japan Program, Massachusetts Institute of Technology
spellingShingle Q180.J3 M22 no.92-11
An empirical study of manufacturing flexibility in printed-circuit board assembly
title An empirical study of manufacturing flexibility in printed-circuit board assembly
title_full An empirical study of manufacturing flexibility in printed-circuit board assembly
title_fullStr An empirical study of manufacturing flexibility in printed-circuit board assembly
title_full_unstemmed An empirical study of manufacturing flexibility in printed-circuit board assembly
title_short An empirical study of manufacturing flexibility in printed-circuit board assembly
title_sort empirical study of manufacturing flexibility in printed circuit board assembly
topic Q180.J3 M22 no.92-11
url http://hdl.handle.net/1721.1/17106