Design tool and methodologies for interconnect reliability analysis in integrated circuits
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.
Main Author: | Alam, Syed Mohiul, 1975- |
---|---|
Other Authors: | Donald E. Troxel and Carl V. Thompson. |
Format: | Thesis |
Language: | en_US |
Published: |
Massachusetts Institute of Technology
2005
|
Subjects: | |
Online Access: | http://hdl.handle.net/1721.1/26722 |
Similar Items
-
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
by: Alam, Syed Mohiul, 1975-
Published: (2005) -
New methodologies for interconnect reliability assessments of integrated circuits
by: Hau-Riege, Stefan P. (Stefan Peter), 1970-
Published: (2006) -
Reliability of copper interconnects in integrated circuits
by: Choi, Zung-Sun
Published: (2008) -
Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits
by: Srikar, V. T. (Vengallatore Thattai), 1972-
Published: (2014) -
On the methodology of assessing hot-carrier reliability of analog circuits
by: Le, Huy X. P
Published: (2014)