Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994.
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| Format: | Thesis |
| Language: | en_US |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/28125 |
| _version_ | 1811076918414409728 |
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| author | Kim, Hyoun-woo |
| author2 | Rafael Reif. |
| author_facet | Rafael Reif. Kim, Hyoun-woo |
| author_sort | Kim, Hyoun-woo |
| collection | MIT |
| description | Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994. |
| first_indexed | 2024-09-23T10:30:37Z |
| format | Thesis |
| id | mit-1721.1/28125 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T10:30:37Z |
| publishDate | 2005 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/281252019-04-12T11:58:28Z Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure Kim, Hyoun-woo Rafael Reif. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Materials Science and Engineering Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994. Includes bibliographical references (leaves 138-143). by Hyoun-woo Kim. Ph.D. 2005-09-26T18:37:04Z 2005-09-26T18:37:04Z 1994 1994 Thesis http://hdl.handle.net/1721.1/28125 32147490 en_US M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 143 leaves 8771647 bytes 8790822 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Materials Science and Engineering Kim, Hyoun-woo Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure |
| title | Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure |
| title_full | Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure |
| title_fullStr | Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure |
| title_full_unstemmed | Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure |
| title_short | Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure |
| title_sort | wafer surface cleaning for silicon homoepitaxy with and without ecr hydrogen plasma exposure |
| topic | Materials Science and Engineering |
| url | http://hdl.handle.net/1721.1/28125 |
| work_keys_str_mv | AT kimhyounwoo wafersurfacecleaningforsiliconhomoepitaxywithandwithoutecrhydrogenplasmaexposure |