Fabrication and characterization of wafer-level gold thermocompression bonding

Fabrication and characterization of wafer-level gold thermocompression bonding

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2003.

Bibliographic Details
Main Author: Tsau, Christine H. (Christine Hsin-Hwa), 1976-
Other Authors: Martin A. Schmidt and S. Mark Spearing.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2006
Subjects:
Materials Science and Engineering.
Online Access:http://hdl.handle.net/1721.1/29975

Similar Items

Similar Items