Critical thickness in silicone resin
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, February 2004.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2006
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| Online Access: | http://hdl.handle.net/1721.1/30125 |
| _version_ | 1826213551274983424 |
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| author | Satorius, Andrew, 1980- |
| author2 | Frederick J. McGarry. |
| author_facet | Frederick J. McGarry. Satorius, Andrew, 1980- |
| author_sort | Satorius, Andrew, 1980- |
| collection | MIT |
| description | Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, February 2004. |
| first_indexed | 2024-09-23T15:51:02Z |
| format | Thesis |
| id | mit-1721.1/30125 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T15:51:02Z |
| publishDate | 2006 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/301252019-04-12T09:08:18Z Critical thickness in silicone resin Satorius, Andrew, 1980- Frederick J. McGarry. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Materials Science and Engineering. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, February 2004. "January 2004." Includes bibliographical references (leaves 77-78). The critical thickness at which a toughness transition occurs in a polymer was determined for the Dow Corning 4-3136 silicone resin. 4-3136 is macroscopically brittle, but becomes up to ten times more ductile when it is processed in the form of a sufficiently thin film. Thickness was controlled for the thin films of amorphous polymer through solution composition variation. The films were spun on highly polished stainless steel at a constant angular velocity. The transition was observed over a range of film thicknesses at several different curing temperatures. Observation of cracking induced by bending and tensile strain was used as the gauge for the transition from brittle to ductile. The critical thickness was observed to have an unambiguous value at low curing temperatures. At higher curing temperatures, the transition occurred more gradually. The critical thickness also increased up to intermediate curing temperatures, then decreased at the highest cure temperature. Crosslink density is theorized as the cause for this cure temperature induced alteration of the critical thickness. by Andrew Satorius. S.M. 2006-03-24T18:21:51Z 2006-03-24T18:21:51Z 2004 Thesis http://hdl.handle.net/1721.1/30125 55872220 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 78 leaves 3120015 bytes 3119823 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Materials Science and Engineering. Satorius, Andrew, 1980- Critical thickness in silicone resin |
| title | Critical thickness in silicone resin |
| title_full | Critical thickness in silicone resin |
| title_fullStr | Critical thickness in silicone resin |
| title_full_unstemmed | Critical thickness in silicone resin |
| title_short | Critical thickness in silicone resin |
| title_sort | critical thickness in silicone resin |
| topic | Materials Science and Engineering. |
| url | http://hdl.handle.net/1721.1/30125 |
| work_keys_str_mv | AT satoriusandrew1980 criticalthicknessinsiliconeresin |