Development of pick-and-place assembly techniques for monolithic optopill integration
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.
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| 格式: | Thesis |
| 语言: | eng |
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Massachusetts Institute of Technology
2006
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| 在线阅读: | http://hdl.handle.net/1721.1/30180 |
| _version_ | 1826213253100863488 |
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| author | Teo, Mindy Simin, 1981- |
| author2 | Clifton G. Fonstad, Jr. |
| author_facet | Clifton G. Fonstad, Jr. Teo, Mindy Simin, 1981- |
| author_sort | Teo, Mindy Simin, 1981- |
| collection | MIT |
| description | Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. |
| first_indexed | 2024-09-23T15:46:27Z |
| format | Thesis |
| id | mit-1721.1/30180 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T15:46:27Z |
| publishDate | 2006 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/301802019-04-11T01:15:16Z Development of pick-and-place assembly techniques for monolithic optopill integration Teo, Mindy Simin, 1981- Clifton G. Fonstad, Jr. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Electrical Engineering and Computer Science. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. Includes bibliographical references (p. 99-101). The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here. by Mindy Simin Teo. S.M. 2006-03-24T18:27:04Z 2006-03-24T18:27:04Z 2004 2005 Thesis http://hdl.handle.net/1721.1/30180 60679424 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 101 p. 6169668 bytes 6181626 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Electrical Engineering and Computer Science. Teo, Mindy Simin, 1981- Development of pick-and-place assembly techniques for monolithic optopill integration |
| title | Development of pick-and-place assembly techniques for monolithic optopill integration |
| title_full | Development of pick-and-place assembly techniques for monolithic optopill integration |
| title_fullStr | Development of pick-and-place assembly techniques for monolithic optopill integration |
| title_full_unstemmed | Development of pick-and-place assembly techniques for monolithic optopill integration |
| title_short | Development of pick-and-place assembly techniques for monolithic optopill integration |
| title_sort | development of pick and place assembly techniques for monolithic optopill integration |
| topic | Electrical Engineering and Computer Science. |
| url | http://hdl.handle.net/1721.1/30180 |
| work_keys_str_mv | AT teomindysimin1981 developmentofpickandplaceassemblytechniquesformonolithicoptopillintegration |