Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.
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Format: | Thesis |
Language: | eng |
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Massachusetts Institute of Technology
2006
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Online Access: | http://hdl.handle.net/1721.1/30311 |
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author | Lee, Hohyun, 1978- |
author2 | Gang Chen. |
author_facet | Gang Chen. Lee, Hohyun, 1978- |
author_sort | Lee, Hohyun, 1978- |
collection | MIT |
description | Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005. |
first_indexed | 2024-09-23T10:38:42Z |
format | Thesis |
id | mit-1721.1/30311 |
institution | Massachusetts Institute of Technology |
language | eng |
last_indexed | 2024-09-23T10:38:42Z |
publishDate | 2006 |
publisher | Massachusetts Institute of Technology |
record_format | dspace |
spelling | mit-1721.1/303112019-04-11T09:44:58Z Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application Lee, Hohyun, 1978- Gang Chen. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Mechanical Engineering. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005. Includes bibliographical references (p. 67-70). To improve the thermoelectric energy conversion efficiency of silicon germanium (SiGe), two methods were used to decrease the thermal conductivity by increasing phonon boundary scattering at interfaces. In the first method, SiGe alloys were annealed at a temperature higher than the melting point to increase the number of grain boundaries. In the second method, SiGe composites were made with nanosize silicon particles. For annealed SiGe alloys thermal conductivity decreased by a factor of two while power factor remained the same value. For SiGe nanocomposite thermal conductivity decreased by a factor of four to that of bulk alloy, but electrical conductivity deteriorated. Future work will focus on increasing electrical conductivity while reducing the thermal conductivity. by Hohyun Lee. S.M. 2006-03-24T18:39:04Z 2006-03-24T18:39:04Z 2005 2005 Thesis http://hdl.handle.net/1721.1/30311 61102483 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 70 p. 3192262 bytes 3199310 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
spellingShingle | Mechanical Engineering. Lee, Hohyun, 1978- Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application |
title | Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application |
title_full | Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application |
title_fullStr | Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application |
title_full_unstemmed | Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application |
title_short | Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application |
title_sort | experimental study of thermal conductivity reduction of silicon germanium nanocomposite for thermoelastic application |
topic | Mechanical Engineering. |
url | http://hdl.handle.net/1721.1/30311 |
work_keys_str_mv | AT leehohyun1978 experimentalstudyofthermalconductivityreductionofsilicongermaniumnanocompositeforthermoelasticapplication |