Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.

Bibliographic Details
Main Author: Lee, Hohyun, 1978-
Other Authors: Gang Chen.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2006
Subjects:
Online Access:http://hdl.handle.net/1721.1/30311
_version_ 1826196854009757696
author Lee, Hohyun, 1978-
author2 Gang Chen.
author_facet Gang Chen.
Lee, Hohyun, 1978-
author_sort Lee, Hohyun, 1978-
collection MIT
description Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.
first_indexed 2024-09-23T10:38:42Z
format Thesis
id mit-1721.1/30311
institution Massachusetts Institute of Technology
language eng
last_indexed 2024-09-23T10:38:42Z
publishDate 2006
publisher Massachusetts Institute of Technology
record_format dspace
spelling mit-1721.1/303112019-04-11T09:44:58Z Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application Lee, Hohyun, 1978- Gang Chen. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Mechanical Engineering. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005. Includes bibliographical references (p. 67-70). To improve the thermoelectric energy conversion efficiency of silicon germanium (SiGe), two methods were used to decrease the thermal conductivity by increasing phonon boundary scattering at interfaces. In the first method, SiGe alloys were annealed at a temperature higher than the melting point to increase the number of grain boundaries. In the second method, SiGe composites were made with nanosize silicon particles. For annealed SiGe alloys thermal conductivity decreased by a factor of two while power factor remained the same value. For SiGe nanocomposite thermal conductivity decreased by a factor of four to that of bulk alloy, but electrical conductivity deteriorated. Future work will focus on increasing electrical conductivity while reducing the thermal conductivity. by Hohyun Lee. S.M. 2006-03-24T18:39:04Z 2006-03-24T18:39:04Z 2005 2005 Thesis http://hdl.handle.net/1721.1/30311 61102483 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 70 p. 3192262 bytes 3199310 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology
spellingShingle Mechanical Engineering.
Lee, Hohyun, 1978-
Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application
title Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application
title_full Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application
title_fullStr Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application
title_full_unstemmed Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application
title_short Experimental study of thermal conductivity reduction of silicon-germanium nanocomposite for thermoelastic application
title_sort experimental study of thermal conductivity reduction of silicon germanium nanocomposite for thermoelastic application
topic Mechanical Engineering.
url http://hdl.handle.net/1721.1/30311
work_keys_str_mv AT leehohyun1978 experimentalstudyofthermalconductivityreductionofsilicongermaniumnanocompositeforthermoelasticapplication