Solution for a modular die-level anodic bonder
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2006
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| Online Access: | http://hdl.handle.net/1721.1/32764 |
| _version_ | 1811087085389479936 |
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| author | Khan, Christopher Joseph, 1982- |
| author2 | Alexander H. Slocum. |
| author_facet | Alexander H. Slocum. Khan, Christopher Joseph, 1982- |
| author_sort | Khan, Christopher Joseph, 1982- |
| collection | MIT |
| description | Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004. |
| first_indexed | 2024-09-23T13:39:33Z |
| format | Thesis |
| id | mit-1721.1/32764 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T13:39:33Z |
| publishDate | 2006 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/327642019-04-10T08:30:51Z Solution for a modular die-level anodic bonder Khan, Christopher Joseph, 1982- Alexander H. Slocum. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Mechanical Engineering. Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004. Includes bibliographical references. Anodic bonding is a common way to package silicon with Pyrex. The anodic bonding process requires high temperature, voltage, and moderate pressure to occur. Often, there are also expectations of alignment of features for things such as power or material delivery. The following thesis proposes a design for a die-level anodic bonding apparatus. It consists of a separate module to meet each requirement; a module for heating, aligning, and applying force. The apparatus is capable of heating the MEMS device to over 400⁰C, applying more than 1000V across the device, applying greater than 4MPa of pressure, and aligning to within 0.5[micro]m in two directions to create an accurately aligned anodic bond. The apparatus met all of these functional requirements and is modular. enough to easily be configured for many other die-level anodic bonding situations. by Christopher Joseph Khan. S.B. 2006-05-15T20:28:19Z 2006-05-15T20:28:19Z 2004 2004 Thesis http://hdl.handle.net/1721.1/32764 57570258 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 29 p. 1481477 bytes 1480233 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Mechanical Engineering. Khan, Christopher Joseph, 1982- Solution for a modular die-level anodic bonder |
| title | Solution for a modular die-level anodic bonder |
| title_full | Solution for a modular die-level anodic bonder |
| title_fullStr | Solution for a modular die-level anodic bonder |
| title_full_unstemmed | Solution for a modular die-level anodic bonder |
| title_short | Solution for a modular die-level anodic bonder |
| title_sort | solution for a modular die level anodic bonder |
| topic | Mechanical Engineering. |
| url | http://hdl.handle.net/1721.1/32764 |
| work_keys_str_mv | AT khanchristopherjoseph1982 solutionforamodulardielevelanodicbonder |