An application of lean principles within a semiconductor manufacturing environment

Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2005.

Bibliographic Details
Main Author: Wildeman, Roy C
Other Authors: Stephen Graves and Daniel Whitney.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2006
Subjects:
Online Access:http://hdl.handle.net/1721.1/34870
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author Wildeman, Roy C
author2 Stephen Graves and Daniel Whitney.
author_facet Stephen Graves and Daniel Whitney.
Wildeman, Roy C
author_sort Wildeman, Roy C
collection MIT
description Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2005.
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spelling mit-1721.1/348702022-01-28T19:23:40Z An application of lean principles within a semiconductor manufacturing environment Wildeman, Roy C Stephen Graves and Daniel Whitney. Leaders for Manufacturing Program. Leaders for Manufacturing Program at MIT Massachusetts Institute of Technology. Department of Mechanical Engineering Sloan School of Management Sloan School of Management. Mechanical Engineering. Leaders for Manufacturing Program. Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2005. Includes bibliographical references (p. 65-66). Intel Corporation's Fab 23 is committed to implementing lean manufacturing to reduce their production cycle times and cost. This thesis is focused around the development of the principles of lean that are most relevant to Intel's complex manufacturing flow and then the application of these principles to improve the operations in a focused area, the Sorting floor. Direct examination of the work in Sort raises the awareness of inefficiencies from overproduction and inventory; viewing this work as a series of structured activities, customer-supplier connections, and simplified flows further crystallizes the need for a structured approach towards WIP management. A pilot implementation of a CONWIP control of inventory demonstrates reductions in cycle time variability and provides a foundation for further improvements. In conclusion, the challenges experienced with changing the manufacturing systems in Sort were largely organizational and likely to be seen in many other operational areas at Fab 23. by Roy C. Wildeman, Jr. S.M. M.B.A. 2006-11-08T16:52:54Z 2006-11-08T16:52:54Z 2005 2005 Thesis http://hdl.handle.net/1721.1/34870 64562549 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 66 p. 4241652 bytes 4244326 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology
spellingShingle Sloan School of Management.
Mechanical Engineering.
Leaders for Manufacturing Program.
Wildeman, Roy C
An application of lean principles within a semiconductor manufacturing environment
title An application of lean principles within a semiconductor manufacturing environment
title_full An application of lean principles within a semiconductor manufacturing environment
title_fullStr An application of lean principles within a semiconductor manufacturing environment
title_full_unstemmed An application of lean principles within a semiconductor manufacturing environment
title_short An application of lean principles within a semiconductor manufacturing environment
title_sort application of lean principles within a semiconductor manufacturing environment
topic Sloan School of Management.
Mechanical Engineering.
Leaders for Manufacturing Program.
url http://hdl.handle.net/1721.1/34870
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