Real time process monitoring of solder paste stencil printing

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.

Bibliographic Details
Main Author: Braunstein, Daniel J. (Daniel Judah)
Other Authors: Haruhiko Asada.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2007
Subjects:
Online Access:http://hdl.handle.net/1721.1/35374
_version_ 1826202853378621440
author Braunstein, Daniel J. (Daniel Judah)
author2 Haruhiko Asada.
author_facet Haruhiko Asada.
Braunstein, Daniel J. (Daniel Judah)
author_sort Braunstein, Daniel J. (Daniel Judah)
collection MIT
description Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.
first_indexed 2024-09-23T12:21:07Z
format Thesis
id mit-1721.1/35374
institution Massachusetts Institute of Technology
language eng
last_indexed 2024-09-23T12:21:07Z
publishDate 2007
publisher Massachusetts Institute of Technology
record_format dspace
spelling mit-1721.1/353742019-04-12T12:06:23Z Real time process monitoring of solder paste stencil printing Braunstein, Daniel J. (Daniel Judah) Haruhiko Asada. Massachusetts Institute of Technology. Dept. of Mechanical Engineering Mechanical Engineering Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994. Includes bibliographical references (leaves 61-64). by Daniel J. Braunstein. M.S. 2007-01-10T15:57:14Z 2007-01-10T15:57:14Z 1994 1994 Thesis http://hdl.handle.net/1721.1/35374 30822279 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 64 leaves 2680802 bytes 2849292 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology
spellingShingle Mechanical Engineering
Braunstein, Daniel J. (Daniel Judah)
Real time process monitoring of solder paste stencil printing
title Real time process monitoring of solder paste stencil printing
title_full Real time process monitoring of solder paste stencil printing
title_fullStr Real time process monitoring of solder paste stencil printing
title_full_unstemmed Real time process monitoring of solder paste stencil printing
title_short Real time process monitoring of solder paste stencil printing
title_sort real time process monitoring of solder paste stencil printing
topic Mechanical Engineering
url http://hdl.handle.net/1721.1/35374
work_keys_str_mv AT braunsteindanieljdanieljudah realtimeprocessmonitoringofsolderpastestencilprinting