Real time process monitoring of solder paste stencil printing
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.
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Format: | Thesis |
Language: | eng |
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Massachusetts Institute of Technology
2007
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Online Access: | http://hdl.handle.net/1721.1/35374 |
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author | Braunstein, Daniel J. (Daniel Judah) |
author2 | Haruhiko Asada. |
author_facet | Haruhiko Asada. Braunstein, Daniel J. (Daniel Judah) |
author_sort | Braunstein, Daniel J. (Daniel Judah) |
collection | MIT |
description | Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994. |
first_indexed | 2024-09-23T12:21:07Z |
format | Thesis |
id | mit-1721.1/35374 |
institution | Massachusetts Institute of Technology |
language | eng |
last_indexed | 2024-09-23T12:21:07Z |
publishDate | 2007 |
publisher | Massachusetts Institute of Technology |
record_format | dspace |
spelling | mit-1721.1/353742019-04-12T12:06:23Z Real time process monitoring of solder paste stencil printing Braunstein, Daniel J. (Daniel Judah) Haruhiko Asada. Massachusetts Institute of Technology. Dept. of Mechanical Engineering Mechanical Engineering Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994. Includes bibliographical references (leaves 61-64). by Daniel J. Braunstein. M.S. 2007-01-10T15:57:14Z 2007-01-10T15:57:14Z 1994 1994 Thesis http://hdl.handle.net/1721.1/35374 30822279 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 64 leaves 2680802 bytes 2849292 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
spellingShingle | Mechanical Engineering Braunstein, Daniel J. (Daniel Judah) Real time process monitoring of solder paste stencil printing |
title | Real time process monitoring of solder paste stencil printing |
title_full | Real time process monitoring of solder paste stencil printing |
title_fullStr | Real time process monitoring of solder paste stencil printing |
title_full_unstemmed | Real time process monitoring of solder paste stencil printing |
title_short | Real time process monitoring of solder paste stencil printing |
title_sort | real time process monitoring of solder paste stencil printing |
topic | Mechanical Engineering |
url | http://hdl.handle.net/1721.1/35374 |
work_keys_str_mv | AT braunsteindanieljdanieljudah realtimeprocessmonitoringofsolderpastestencilprinting |