Real time process monitoring of solder paste stencil printing

Real time process monitoring of solder paste stencil printing

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.

Bibliographic Details
Main Author: Braunstein, Daniel J. (Daniel Judah)
Other Authors: Haruhiko Asada.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2007
Subjects:
Mechanical Engineering
Online Access:http://hdl.handle.net/1721.1/35374

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