MEMS Materials and Processes: a research overview
An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybr...
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| Format: | Article |
| Language: | en_US |
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2003
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| Online Access: | http://hdl.handle.net/1721.1/3667 |
| Summary: | An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybrid structures, modeling of wafer bonding processes and development of high temperature fluid interconnections. Emphasis is placed on the key areas of materials science and engineering. |
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