Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects

Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects

Failure mechanisms observed in electromigration (EM) stressed dual damascene Cu/SiO₂ interconnects trees were studied and simulated. Failure sites with ‘melt patch’ or ‘crater’ are common for test structures in the top metal layer, though the occurrence of such failure modes probably depends on...

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Bibliographic Details
Main Authors: Chang, Choon Wai, Gan, C.L., Thompson, Carl V., Pey, Kin Leong, Choi, Wee Kiong
Format: Article
Language:en_US
Published: 2003
Subjects:
electromigration
Joule heating
failure mechanism
Online Access:http://hdl.handle.net/1721.1/3727

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