Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees

Electromigration tests on different Cu dual-damascene interconnect tree structures consisting of various numbers of straight via-to-via lines connected at the common middle terminal have been carried out. Like Al-based interconnects, the reliability of a segment in a Cu-based interconnect tree stron...

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Bibliographic Details
Main Authors: Gan, C.L., Thompson, Carl V., Pey, Kin Leong, Choi, Wee Kiong
Format: Article
Language:en_US
Published: 2003
Subjects:
Online Access:http://hdl.handle.net/1721.1/3730