Carbon nanotube interconnects for IC chips
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | eng |
| Published: |
Massachusetts Institute of Technology
2007
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/1721.1/37373 |
| _version_ | 1811096958006198272 |
|---|---|
| author | Anwar Ali, Hashina Parveen |
| author2 | Carl V. Thompson. |
| author_facet | Carl V. Thompson. Anwar Ali, Hashina Parveen |
| author_sort | Anwar Ali, Hashina Parveen |
| collection | MIT |
| description | Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006. |
| first_indexed | 2024-09-23T16:52:04Z |
| format | Thesis |
| id | mit-1721.1/37373 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T16:52:04Z |
| publishDate | 2007 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/373732019-04-10T21:27:06Z Carbon nanotube interconnects for IC chips CNT interconnects for Integrated Chip chips Anwar Ali, Hashina Parveen Carl V. Thompson. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Materials Science and Engineering. Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006. Includes bibliographical references (leaves 93-94). Carbon nanotubes (CNTs) have been investigated as candidate materials to replace or augment the existing copper-based technologies as interconnects for Integrated Circuit (IC) chips. Being ballistic conductors, CNTs are capable of carrying higher current densities of up to 10¹⁰A/cm² and high thermal conductivity. This thesis examines the technological aspect of carbon nanotubes - how these tubes can excel in place of copper in terms of their performance and integration into the current commercial IC chip process. A detailed literature review is covered, together with a performance analysis of the resistances between copper and CNT interconnects. Further, a business model is proposed on the possibility of introducing this technology into the mainstream IC industry. by Hashina Parveen Anwar Ali. M.Eng. 2007-05-16T18:26:36Z 2007-05-16T18:26:36Z 2006 2006 Thesis http://hdl.handle.net/1721.1/37373 104699663 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 97 leaves application/pdf Massachusetts Institute of Technology |
| spellingShingle | Materials Science and Engineering. Anwar Ali, Hashina Parveen Carbon nanotube interconnects for IC chips |
| title | Carbon nanotube interconnects for IC chips |
| title_full | Carbon nanotube interconnects for IC chips |
| title_fullStr | Carbon nanotube interconnects for IC chips |
| title_full_unstemmed | Carbon nanotube interconnects for IC chips |
| title_short | Carbon nanotube interconnects for IC chips |
| title_sort | carbon nanotube interconnects for ic chips |
| topic | Materials Science and Engineering. |
| url | http://hdl.handle.net/1721.1/37373 |
| work_keys_str_mv | AT anwaralihashinaparveen carbonnanotubeinterconnectsforicchips AT anwaralihashinaparveen cntinterconnectsforintegratedchipchips |