Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits

Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007.

Bibliographic Details
Main Author: Tadepalli, Rajappa, 1979-
Other Authors: Carl V. Thompson.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2007
Subjects:
Materials Science and Engineering.
Online Access:http://hdl.handle.net/1721.1/38515

Similar Items

Similar Items