Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures
Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS). We present an experiment to characterize a polysilicon CMP process with the specific goal of examining...
| Main Authors: | , |
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| Format: | Article |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://hdl.handle.net/1721.1/3901 |
| _version_ | 1826200460617318400 |
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| author | Tang, Brian D. Boning, Duane S. |
| author_facet | Tang, Brian D. Boning, Duane S. |
| author_sort | Tang, Brian D. |
| collection | MIT |
| description | Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS). We present an experiment to characterize a polysilicon CMP process with the specific goal of examining MEMS sized test structures. We utilize previously discussed models and examine whether the same assumptions from IC CMP can be made for MEMS CMP. We find that CMP at the MEMS scale is not just pattern density dependent, but also partly dependent on feature size. Also, we find that new layout designs relevant to MEMS can negatively impact how well existing CMP models simulate polishing, motivating the need for further model development. |
| first_indexed | 2024-09-23T11:36:49Z |
| format | Article |
| id | mit-1721.1/3901 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T11:36:49Z |
| publishDate | 2003 |
| record_format | dspace |
| spelling | mit-1721.1/39012019-04-10T19:06:25Z Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures Tang, Brian D. Boning, Duane S. chemical-mechanical polishing polysilicon MEMS CMP planarization Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS). We present an experiment to characterize a polysilicon CMP process with the specific goal of examining MEMS sized test structures. We utilize previously discussed models and examine whether the same assumptions from IC CMP can be made for MEMS CMP. We find that CMP at the MEMS scale is not just pattern density dependent, but also partly dependent on feature size. Also, we find that new layout designs relevant to MEMS can negatively impact how well existing CMP models simulate polishing, motivating the need for further model development. Singapore-MIT Alliance (SMA) 2003-12-14T23:41:10Z 2003-12-14T23:41:10Z 2004-01 Article http://hdl.handle.net/1721.1/3901 en_US Innovation in Manufacturing Systems and Technology (IMST); 247912 bytes application/pdf application/pdf |
| spellingShingle | chemical-mechanical polishing polysilicon MEMS CMP planarization Tang, Brian D. Boning, Duane S. Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures |
| title | Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures |
| title_full | Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures |
| title_fullStr | Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures |
| title_full_unstemmed | Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures |
| title_short | Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures |
| title_sort | characterization and modeling of chemical mechanical polishing for polysilicon microstructures |
| topic | chemical-mechanical polishing polysilicon MEMS CMP planarization |
| url | http://hdl.handle.net/1721.1/3901 |
| work_keys_str_mv | AT tangbriand characterizationandmodelingofchemicalmechanicalpolishingforpolysiliconmicrostructures AT boningduanes characterizationandmodelingofchemicalmechanicalpolishingforpolysiliconmicrostructures |