Length Effects on the Reliability of Dual-Damascene Cu Interconnects
The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are â...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | en_US |
| Published: |
2003
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| Subjects: | |
| Online Access: | http://hdl.handle.net/1721.1/3977 |
| _version_ | 1826213451944427520 |
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| author | Wei, F. Hau-Riege, S.P. Gan, C.L. Thompson, Carl V. Clement, J.J. Tay, H.L. Yu, B. Radhakrishnan, M.K. Pey, Kin Leong Choi, Wee Kiong |
| author_facet | Wei, F. Hau-Riege, S.P. Gan, C.L. Thompson, Carl V. Clement, J.J. Tay, H.L. Yu, B. Radhakrishnan, M.K. Pey, Kin Leong Choi, Wee Kiong |
| author_sort | Wei, F. |
| collection | MIT |
| description | The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are âimmortal’. Furthermore, we found multi-modal failure statistics for long lines, suggesting multiple failure mechanisms. Some long Cu interconnect segments have very large lifetimes, whereas in Al segments, lifetimes decrease continuously with increasing line length. It is postulated that the large lifetimes observed in long Cu lines result from liner rupture at the bottom of the vias, which allows continuous flow of Cu between the two bond pads. As a consequence, the average lifetimes of short lines and long lines can be higher than those of lines with intermediate lengths. |
| first_indexed | 2024-09-23T15:49:25Z |
| format | Article |
| id | mit-1721.1/3977 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T15:49:25Z |
| publishDate | 2003 |
| record_format | dspace |
| spelling | mit-1721.1/39772019-04-10T08:59:40Z Length Effects on the Reliability of Dual-Damascene Cu Interconnects Wei, F. Hau-Riege, S.P. Gan, C.L. Thompson, Carl V. Clement, J.J. Tay, H.L. Yu, B. Radhakrishnan, M.K. Pey, Kin Leong Choi, Wee Kiong interconnects reliability length effects The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are âimmortal’. Furthermore, we found multi-modal failure statistics for long lines, suggesting multiple failure mechanisms. Some long Cu interconnect segments have very large lifetimes, whereas in Al segments, lifetimes decrease continuously with increasing line length. It is postulated that the large lifetimes observed in long Cu lines result from liner rupture at the bottom of the vias, which allows continuous flow of Cu between the two bond pads. As a consequence, the average lifetimes of short lines and long lines can be higher than those of lines with intermediate lengths. Singapore-MIT Alliance (SMA) 2003-12-20T19:42:21Z 2003-12-20T19:42:21Z 2002-01 Article http://hdl.handle.net/1721.1/3977 en_US Advanced Materials for Micro- and Nano-Systems (AMMNS); 228936 bytes application/pdf application/pdf |
| spellingShingle | interconnects reliability length effects Wei, F. Hau-Riege, S.P. Gan, C.L. Thompson, Carl V. Clement, J.J. Tay, H.L. Yu, B. Radhakrishnan, M.K. Pey, Kin Leong Choi, Wee Kiong Length Effects on the Reliability of Dual-Damascene Cu Interconnects |
| title | Length Effects on the Reliability of Dual-Damascene Cu Interconnects |
| title_full | Length Effects on the Reliability of Dual-Damascene Cu Interconnects |
| title_fullStr | Length Effects on the Reliability of Dual-Damascene Cu Interconnects |
| title_full_unstemmed | Length Effects on the Reliability of Dual-Damascene Cu Interconnects |
| title_short | Length Effects on the Reliability of Dual-Damascene Cu Interconnects |
| title_sort | length effects on the reliability of dual damascene cu interconnects |
| topic | interconnects reliability length effects |
| url | http://hdl.handle.net/1721.1/3977 |
| work_keys_str_mv | AT weif lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT hauriegesp lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT gancl lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT thompsoncarlv lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT clementjj lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT tayhl lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT yub lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT radhakrishnanmk lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT peykinleong lengtheffectsonthereliabilityofdualdamascenecuinterconnects AT choiweekiong lengtheffectsonthereliabilityofdualdamascenecuinterconnects |