Length Effects on the Reliability of Dual-Damascene Cu Interconnects
The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are â...
| Main Authors: | , , , , , , , , , |
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| 格式: | 文件 |
| 语言: | en_US |
| 出版: |
2003
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| 主题: | |
| 在线阅读: | http://hdl.handle.net/1721.1/3977 |