Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique

This paper presents a new technique for the monolithic heterogeneous integration of compound semiconductor devices with silicon integrated circuits, and establishes the theoretical foundation for a key element of the process, tailored magnetic attraction and retention. It is shown how a patterned th...

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Main Author: Fonstad, Clifton G. Jr.
Format: Article
Language:en_US
Published: 2003
Subjects:
Online Access:http://hdl.handle.net/1721.1/3978
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author Fonstad, Clifton G. Jr.
author_facet Fonstad, Clifton G. Jr.
author_sort Fonstad, Clifton G. Jr.
collection MIT
description This paper presents a new technique for the monolithic heterogeneous integration of compound semiconductor devices with silicon integrated circuits, and establishes the theoretical foundation for a key element of the process, tailored magnetic attraction and retention. It is shown how a patterned thin film of hard magnetic material can be used to engineer the attraction between the film and nanopills covered with a soft magnetic material. With a suitable choice of pattern, it is anticipated that it will be possible to achieve complete filling of recesses in the surface of fully-processed integrated circuit wafers, preparatory to subsequent processing to fabricate the nanopills into heterostructure devices integrated monolithically with the pre-existing electronics.
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spelling mit-1721.1/39782019-04-10T08:59:52Z Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique Fonstad, Clifton G. Jr. optoelectronics heterogeneous integration self assembly VCSELs III-V heterostructures This paper presents a new technique for the monolithic heterogeneous integration of compound semiconductor devices with silicon integrated circuits, and establishes the theoretical foundation for a key element of the process, tailored magnetic attraction and retention. It is shown how a patterned thin film of hard magnetic material can be used to engineer the attraction between the film and nanopills covered with a soft magnetic material. With a suitable choice of pattern, it is anticipated that it will be possible to achieve complete filling of recesses in the surface of fully-processed integrated circuit wafers, preparatory to subsequent processing to fabricate the nanopills into heterostructure devices integrated monolithically with the pre-existing electronics. Singapore-MIT Alliance (SMA) 2003-12-20T19:43:44Z 2003-12-20T19:43:44Z 2002-01 Article http://hdl.handle.net/1721.1/3978 en_US Advanced Materials for Micro- and Nano-Systems (AMMNS); 96834 bytes application/pdf application/pdf
spellingShingle optoelectronics
heterogeneous integration
self assembly
VCSELs
III-V heterostructures
Fonstad, Clifton G. Jr.
Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
title Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
title_full Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
title_fullStr Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
title_full_unstemmed Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
title_short Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
title_sort magnetically assisted statistical assembly a new heterogeneous integration technique
topic optoelectronics
heterogeneous integration
self assembly
VCSELs
III-V heterostructures
url http://hdl.handle.net/1721.1/3978
work_keys_str_mv AT fonstadcliftongjr magneticallyassistedstatisticalassemblyanewheterogeneousintegrationtechnique