| _version_ |
1826208526578483200
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| author2 |
Alam, Syed Mohiul, 1975-
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| author_facet |
Alam, Syed Mohiul, 1975-
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| collection |
MIT
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| description |
Supervised by Donald E. Troxel and Carl V. Thompson.
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| first_indexed |
2024-09-23T14:07:01Z
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| id |
mit-1721.1/4112
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| institution |
Massachusetts Institute of Technology
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| language |
eng
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| last_indexed |
2024-09-23T14:07:01Z
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| publishDate |
2004
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| record_format |
dspace
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| spelling |
mit-1721.1/41122019-04-12T08:19:40Z ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits Technology-generic tool for interconnect reliability projections in 3D integrated circuits Alam, Syed Mohiul, 1975- Supervised by Donald E. Troxel and Carl V. Thompson. Also issued as Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2001. Includes bibliographical references (p. 107-112). by Syed Mohiul Alam. 2004-03-02T18:26:26Z 2004-03-02T18:26:26Z 2001 2001 http://hdl.handle.net/1721.1/4112 eng Technical report (Massachusetts Institute of Technology. Research Laboratory of Electronics) ; 652. 112 p. 7027671 bytes application/pdf application/pdf
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| spellingShingle |
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
|
| title |
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
|
| title_full |
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
|
| title_fullStr |
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
|
| title_full_unstemmed |
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
|
| title_short |
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
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| title_sort |
erni 3d a technology generic tool for interconnect reliability projections in 3d integrated circuits
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| url |
http://hdl.handle.net/1721.1/4112
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