Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.

Bibliographic Details
Main Author: Guzek, John S. (John Stephen)
Other Authors: Subra Suresh.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2008
Subjects:
Materials Science and Engineering
Online Access:http://hdl.handle.net/1721.1/41401

Similar Items

Similar Items