Investigating packaging effects on bandgap references
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2008
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| Online Access: | http://hdl.handle.net/1721.1/41665 |
| _version_ | 1826212481602682880 |
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| author | Palakodety, Ravi (Ravi Kiran) |
| author2 | Tick Houk and Charles Sodini. |
| author_facet | Tick Houk and Charles Sodini. Palakodety, Ravi (Ravi Kiran) |
| author_sort | Palakodety, Ravi (Ravi Kiran) |
| collection | MIT |
| description | Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007. |
| first_indexed | 2024-09-23T15:22:48Z |
| format | Thesis |
| id | mit-1721.1/41665 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T15:22:48Z |
| publishDate | 2008 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/416652019-04-11T04:21:52Z Investigating packaging effects on bandgap references Palakodety, Ravi (Ravi Kiran) Tick Houk and Charles Sodini. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. Electrical Engineering and Computer Science. Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007. Includes bibliographical references (p. 95-96). This thesis investigates packaging effects on precision bandgap voltage references used in LTC switching regulators. Packaging stress causes a mean offset and room temperature distribution widening of the bandgap reference output voltage, as well as inconsistent temperature characteristics. Bandgap references with and without a proprietary stress-relief mechanism were compared to determine the impact of packaging stress on reference performance. References without stress-relief showed a mean offset of -2.3mV and spread of 10mV, while references with stress-relief showed a mean offset of -2.0mV and spread of 3.6mV. References with stress relief exhibited more consistent temperature coefficients than references without stress relief. A test chip was fabricated to allow measurement of VBE and AVBE within the bandgap reference. Parts with stress-relief showed tighter VBE and AVBE distributions, as well as more favorable temperature characteristics. The experiments in this thesis show that stress-relief is effective at improving bandgap reference performance. by Ravi Palakodety. M.Eng. 2008-05-19T16:06:51Z 2008-05-19T16:06:51Z 2007 2007 Thesis http://hdl.handle.net/1721.1/41665 220914445 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 96 p. application/pdf Massachusetts Institute of Technology |
| spellingShingle | Electrical Engineering and Computer Science. Palakodety, Ravi (Ravi Kiran) Investigating packaging effects on bandgap references |
| title | Investigating packaging effects on bandgap references |
| title_full | Investigating packaging effects on bandgap references |
| title_fullStr | Investigating packaging effects on bandgap references |
| title_full_unstemmed | Investigating packaging effects on bandgap references |
| title_short | Investigating packaging effects on bandgap references |
| title_sort | investigating packaging effects on bandgap references |
| topic | Electrical Engineering and Computer Science. |
| url | http://hdl.handle.net/1721.1/41665 |
| work_keys_str_mv | AT palakodetyraviravikiran investigatingpackagingeffectsonbandgapreferences |