Full lead time mapping, analysis and improvement for packaging product manufacturing
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2008.
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | eng |
| Published: |
Massachusetts Institute of Technology
2009
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/1721.1/46156 |
| _version_ | 1826190890928963584 |
|---|---|
| author | Jin, Yi, M. Eng. Massachusetts Institute of Technology |
| author2 | Stanley B. Gershwin. |
| author_facet | Stanley B. Gershwin. Jin, Yi, M. Eng. Massachusetts Institute of Technology |
| author_sort | Jin, Yi, M. Eng. Massachusetts Institute of Technology |
| collection | MIT |
| description | Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2008. |
| first_indexed | 2024-09-23T08:46:54Z |
| format | Thesis |
| id | mit-1721.1/46156 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T08:46:54Z |
| publishDate | 2009 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/461562022-01-13T07:54:36Z Full lead time mapping, analysis and improvement for packaging product manufacturing Jin, Yi, M. Eng. Massachusetts Institute of Technology Stanley B. Gershwin. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Department of Mechanical Engineering Mechanical Engineering. Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2008. Includes bibliographical references (leaf 80). Service level is significant for the customers of a packaging product manufacturing company, especially for the customers with large- volume and high-value orders. To improve the service level will not only provide better service to the customers, but also enhance the relationships to ensure the achievement of the company business. In other words, the company has to fulfill each order quickly and well to obtain and maintain a high service level. A study of the whole supply chain for one specific product from the customer order placement to the customer finished goods (FGs) receipt was performed with the goal of improving the service level by reducing the customer lead time. Specially, the project mapped the customer lead time through studying each process like order handling, production and the FGs delivery. Based on the map, the current performance of the company for this product was known and further improvement opportunities were discussed. Because of the time limitations, general recommendations, like defect reduction in the production and data sharing in order handling, were made to narrow the gap from the company objectives to get things probably improved. This thesis focused on learning of the processes and analysis of the customer lead time for one specific product. However, there should be in-depth study of future work to have things improved. And the same approach might be applied to the products with the same properties in Technological Packaging Singapore's product portfolio. by Yi Jin. M.Eng. 2009-06-30T17:31:11Z 2009-06-30T17:31:11Z 2008 2008 Thesis http://hdl.handle.net/1721.1/46156 399638324 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 86 leaves application/pdf Massachusetts Institute of Technology |
| spellingShingle | Mechanical Engineering. Jin, Yi, M. Eng. Massachusetts Institute of Technology Full lead time mapping, analysis and improvement for packaging product manufacturing |
| title | Full lead time mapping, analysis and improvement for packaging product manufacturing |
| title_full | Full lead time mapping, analysis and improvement for packaging product manufacturing |
| title_fullStr | Full lead time mapping, analysis and improvement for packaging product manufacturing |
| title_full_unstemmed | Full lead time mapping, analysis and improvement for packaging product manufacturing |
| title_short | Full lead time mapping, analysis and improvement for packaging product manufacturing |
| title_sort | full lead time mapping analysis and improvement for packaging product manufacturing |
| topic | Mechanical Engineering. |
| url | http://hdl.handle.net/1721.1/46156 |
| work_keys_str_mv | AT jinyimengmassachusettsinstituteoftechnology fullleadtimemappinganalysisandimprovementforpackagingproductmanufacturing |