Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2010
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| Online Access: | http://hdl.handle.net/1721.1/50398 |
| _version_ | 1826189307744878592 |
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| author | Clough, Sherry L. (Sherry Lynn), 1969- |
| author2 | Roy Welsch and Frederic McGarry. |
| author_facet | Roy Welsch and Frederic McGarry. Clough, Sherry L. (Sherry Lynn), 1969- |
| author_sort | Clough, Sherry L. (Sherry Lynn), 1969- |
| collection | MIT |
| description | Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998. |
| first_indexed | 2024-09-23T08:13:01Z |
| format | Thesis |
| id | mit-1721.1/50398 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T08:13:01Z |
| publishDate | 2010 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/503982019-04-09T17:21:37Z Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability Clough, Sherry L. (Sherry Lynn), 1969- Roy Welsch and Frederic McGarry. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Sloan School of Management Sloan School of Management Materials Science and Engineering Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998. Includes bibliographical references (p. 109-110). by Sherry L. Clough. M.S. 2010-01-07T20:35:16Z 2010-01-07T20:35:16Z 1998 1998 Thesis http://hdl.handle.net/1721.1/50398 40606893 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 110 p. application/pdf Massachusetts Institute of Technology |
| spellingShingle | Sloan School of Management Materials Science and Engineering Clough, Sherry L. (Sherry Lynn), 1969- Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability |
| title | Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability |
| title_full | Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability |
| title_fullStr | Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability |
| title_full_unstemmed | Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability |
| title_short | Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability |
| title_sort | flip chip attachment methods a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability |
| topic | Sloan School of Management Materials Science and Engineering |
| url | http://hdl.handle.net/1721.1/50398 |
| work_keys_str_mv | AT cloughsherrylsherrylynn1969 flipchipattachmentmethodsamethodologyforevaluatingtheeffectsofsupplierprocessvariationandsupplierrelationshipsonproductreliability |