Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability

Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability

Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.

Bibliographic Details
Main Author: Clough, Sherry L. (Sherry Lynn), 1969-
Other Authors: Roy Welsch and Frederic McGarry.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2010
Subjects:
Sloan School of Management
Materials Science and Engineering
Online Access:http://hdl.handle.net/1721.1/50398

Internet

http://hdl.handle.net/1721.1/50398

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