Development of a low-cost, rapid-cycle hot embossing system for microscale parts

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.

Bibliographic Details
Main Author: Hale, Melinda (Melinda Rae)
Other Authors: David E. Hardt.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2010
Subjects:
Online Access:http://hdl.handle.net/1721.1/50565
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author Hale, Melinda (Melinda Rae)
author2 David E. Hardt.
author_facet David E. Hardt.
Hale, Melinda (Melinda Rae)
author_sort Hale, Melinda (Melinda Rae)
collection MIT
description Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.
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spelling mit-1721.1/505652019-04-12T23:33:37Z Development of a low-cost, rapid-cycle hot embossing system for microscale parts Hale, Melinda (Melinda Rae) David E. Hardt. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Mechanical Engineering. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009. Includes bibliographical references (leaves 135-137). Hot embossing is an effective technology for reproducing micro-scale features in polymeric materials, but large-scale adoption of this method is hindered by high capital costs and low cycle times relative to other technologies, and a general lack of manufacturing equipment. This work details a hot embossing machine design strategy motivated by maximum production speed and quality with minimal capital cost. The approach is to "right-size" the machine for specific product needs while making the design flexible and scalable. Toward this end, a minimal number of components were used, commercially available off-the-shelf components were chosen where possible, system layout was designed to be modular, and system size was scaled for the intended products (in this case microfluidic devices). Innovative design aspects include the use of new ceramic substrate heaters for electrical heating, use of a moveable heat sink to minimize heat load during the heating cycle, and the careful design of the thermal elements to minimize the heating and cooling cycle times. The capital cost and the cost per part produced with this machine are estimated to be an order of magnitude less than currently available hot embossing manufacturing options. The hot embossing machine has been tested extensively to characterize the process variability. The minimum cycle time is two minutes, and microstructures are replicated within a maximum of a 25mm by 75mm area with very low relative variance in dimensions. by Melinda Hale. S.M. 2010-01-07T20:54:00Z 2010-01-07T20:54:00Z 2009 2009 Thesis http://hdl.handle.net/1721.1/50565 463643198 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 137 leaves application/pdf Massachusetts Institute of Technology
spellingShingle Mechanical Engineering.
Hale, Melinda (Melinda Rae)
Development of a low-cost, rapid-cycle hot embossing system for microscale parts
title Development of a low-cost, rapid-cycle hot embossing system for microscale parts
title_full Development of a low-cost, rapid-cycle hot embossing system for microscale parts
title_fullStr Development of a low-cost, rapid-cycle hot embossing system for microscale parts
title_full_unstemmed Development of a low-cost, rapid-cycle hot embossing system for microscale parts
title_short Development of a low-cost, rapid-cycle hot embossing system for microscale parts
title_sort development of a low cost rapid cycle hot embossing system for microscale parts
topic Mechanical Engineering.
url http://hdl.handle.net/1721.1/50565
work_keys_str_mv AT halemelindamelindarae developmentofalowcostrapidcyclehotembossingsystemformicroscaleparts