Packaging and qualification of single photon counting avalanche photodiode focal plane arrays

Avalanche Photodiode (APD) photon counting arrays are finding an increasing role in defense applications in laser radar and optical communications. As these system concepts mature, the need for reliable screening, test, assembly and packaging of these novel devices has become increasingly critical....

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Main Authors: Verghese, Simon, Ruff, Albert C., Brattain, Michael A., McIntosh, K. Alexander, Smith, Gary M., Funk, Joseph E.
Other Authors: Lincoln Laboratory
Format: Article
Language:en_US
Published: The International Society for Optical Engineering 2010
Online Access:http://hdl.handle.net/1721.1/52666
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author Verghese, Simon
Ruff, Albert C.
Brattain, Michael A.
McIntosh, K. Alexander
Smith, Gary M.
Funk, Joseph E.
author2 Lincoln Laboratory
author_facet Lincoln Laboratory
Verghese, Simon
Ruff, Albert C.
Brattain, Michael A.
McIntosh, K. Alexander
Smith, Gary M.
Funk, Joseph E.
author_sort Verghese, Simon
collection MIT
description Avalanche Photodiode (APD) photon counting arrays are finding an increasing role in defense applications in laser radar and optical communications. As these system concepts mature, the need for reliable screening, test, assembly and packaging of these novel devices has become increasingly critical. MIT Lincoln Laboratory has put significant effort into the screening, reliability testing, and packaging of these components. To provide rapid test and measurement of the APD devices under development, several custom parallel measurement and Geiger-mode (Gm) aging systems have been developed. Another challenge is the accurate attachment of the microlens arrays with the APD arrays to maximize the photon detection efficiency. We have developed an active alignment process with single µm precision in all six degrees of freespace alignment. This is suitable for the alignment of arrays with active areas as small as 5 µm. Finally, we will discuss a focal plane array (FPA) packaging qualification effort, to verify that single photon counting FPAs can survive in future airborne systems.
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spelling mit-1721.1/526662022-09-29T13:32:14Z Packaging and qualification of single photon counting avalanche photodiode focal plane arrays Verghese, Simon Ruff, Albert C. Brattain, Michael A. McIntosh, K. Alexander Smith, Gary M. Funk, Joseph E. Lincoln Laboratory Funk, Joseph E. Verghese, Simon Ruff, Albert C. Brattain, Michael A. McIntosh, K. Alexander Smith, Gary M. Funk, Joseph E. Avalanche Photodiode (APD) photon counting arrays are finding an increasing role in defense applications in laser radar and optical communications. As these system concepts mature, the need for reliable screening, test, assembly and packaging of these novel devices has become increasingly critical. MIT Lincoln Laboratory has put significant effort into the screening, reliability testing, and packaging of these components. To provide rapid test and measurement of the APD devices under development, several custom parallel measurement and Geiger-mode (Gm) aging systems have been developed. Another challenge is the accurate attachment of the microlens arrays with the APD arrays to maximize the photon detection efficiency. We have developed an active alignment process with single µm precision in all six degrees of freespace alignment. This is suitable for the alignment of arrays with active areas as small as 5 µm. Finally, we will discuss a focal plane array (FPA) packaging qualification effort, to verify that single photon counting FPAs can survive in future airborne systems. Defense Advanced Research Project Agency (Air Force contract number FA8721-05-C-0002) 2010-03-17T16:46:22Z 2010-03-17T16:46:22Z 2009-04 Article http://purl.org/eprint/type/JournalArticle 0277-786X http://hdl.handle.net/1721.1/52666 Funk, Joseph E. et al. “Packaging and qualification of single-photon counting avalanche photodiode focal plane arrays.” Advanced Photon Counting Techniques III. Ed. Mark A. Itzler & Joe C. Campbell. Orlando, FL, USA: SPIE, 2009. 73200S-9. © 2009 SPIE--The International Society for Optical Engineering en_US http://dx.doi.org/10.1117/12.821294 Proceedings of SPIE Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. application/pdf The International Society for Optical Engineering SPIE
spellingShingle Verghese, Simon
Ruff, Albert C.
Brattain, Michael A.
McIntosh, K. Alexander
Smith, Gary M.
Funk, Joseph E.
Packaging and qualification of single photon counting avalanche photodiode focal plane arrays
title Packaging and qualification of single photon counting avalanche photodiode focal plane arrays
title_full Packaging and qualification of single photon counting avalanche photodiode focal plane arrays
title_fullStr Packaging and qualification of single photon counting avalanche photodiode focal plane arrays
title_full_unstemmed Packaging and qualification of single photon counting avalanche photodiode focal plane arrays
title_short Packaging and qualification of single photon counting avalanche photodiode focal plane arrays
title_sort packaging and qualification of single photon counting avalanche photodiode focal plane arrays
url http://hdl.handle.net/1721.1/52666
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