Heat transfer via dropwise condensation on hydrophobic microstructured surfaces
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2010
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| Online Access: | http://hdl.handle.net/1721.1/54510 |
| _version_ | 1826205710469300224 |
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| author | Ruleman, Karlen E. (Karlen Elizabeth) |
| author2 | Evelyn N. Wang. |
| author_facet | Evelyn N. Wang. Ruleman, Karlen E. (Karlen Elizabeth) |
| author_sort | Ruleman, Karlen E. (Karlen Elizabeth) |
| collection | MIT |
| description | Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009. |
| first_indexed | 2024-09-23T13:17:42Z |
| format | Thesis |
| id | mit-1721.1/54510 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T13:17:42Z |
| publishDate | 2010 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/545102019-04-12T23:37:42Z Heat transfer via dropwise condensation on hydrophobic microstructured surfaces Ruleman, Karlen E. (Karlen Elizabeth) Evelyn N. Wang. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Mechanical Engineering. Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009. Cataloged from PDF version of thesis. Includes bibliographical references (p. 22). Dropwise condensation has the potential to greatly increase heat transfer rates. Heat transfer coefficients by dropwise condensation and film condensation on microstructured silicon chips were compared. Heat transfer coefficients are found to be seventy percent higher in the hydrophobic, dropwise condensation case relative to the hydrophilic, film condensation case. With this increased heat transfer coefficient, dropwise condensation using microstructures could improve many heat exchange applications, particularly electronics cooling. by Karlen E. Ruleman. S.B. 2010-04-28T15:44:15Z 2010-04-28T15:44:15Z 2009 2009 Thesis http://hdl.handle.net/1721.1/54510 558876151 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 24 p. application/pdf Massachusetts Institute of Technology |
| spellingShingle | Mechanical Engineering. Ruleman, Karlen E. (Karlen Elizabeth) Heat transfer via dropwise condensation on hydrophobic microstructured surfaces |
| title | Heat transfer via dropwise condensation on hydrophobic microstructured surfaces |
| title_full | Heat transfer via dropwise condensation on hydrophobic microstructured surfaces |
| title_fullStr | Heat transfer via dropwise condensation on hydrophobic microstructured surfaces |
| title_full_unstemmed | Heat transfer via dropwise condensation on hydrophobic microstructured surfaces |
| title_short | Heat transfer via dropwise condensation on hydrophobic microstructured surfaces |
| title_sort | heat transfer via dropwise condensation on hydrophobic microstructured surfaces |
| topic | Mechanical Engineering. |
| url | http://hdl.handle.net/1721.1/54510 |
| work_keys_str_mv | AT rulemankarlenekarlenelizabeth heattransferviadropwisecondensationonhydrophobicmicrostructuredsurfaces |