Digital-pixel focal plane array development
Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 µm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compa...
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| Format: | Article |
| Language: | en_US |
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Society of Photo-optical Instrumentation Engineers
2010
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| Online Access: | http://hdl.handle.net/1721.1/58475 |
| _version_ | 1811074764774572032 |
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| author | Brown, Matthew G. Baker, Justin J. Colonero, Curtis B. Costa, Joseph S. Gardner, Thomas D. Kelly, Michael W. Schultz, Kenneth I. Tyrrell, Brian M. Wey, James R. |
| author2 | Lincoln Laboratory |
| author_facet | Lincoln Laboratory Brown, Matthew G. Baker, Justin J. Colonero, Curtis B. Costa, Joseph S. Gardner, Thomas D. Kelly, Michael W. Schultz, Kenneth I. Tyrrell, Brian M. Wey, James R. |
| author_sort | Brown, Matthew G. |
| collection | MIT |
| description | Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 µm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 µm have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology. |
| first_indexed | 2024-09-23T09:55:00Z |
| format | Article |
| id | mit-1721.1/58475 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T09:55:00Z |
| publishDate | 2010 |
| publisher | Society of Photo-optical Instrumentation Engineers |
| record_format | dspace |
| spelling | mit-1721.1/584752022-09-30T17:40:45Z Digital-pixel focal plane array development Brown, Matthew G. Baker, Justin J. Colonero, Curtis B. Costa, Joseph S. Gardner, Thomas D. Kelly, Michael W. Schultz, Kenneth I. Tyrrell, Brian M. Wey, James R. Lincoln Laboratory Brown, Matthew G. Brown, Matthew G. Baker, Justin J. Colonero, Curtis B. Costa, Joseph S. Gardner, Thomas D. Kelly, Michael W. Schultz, Kenneth I. Tyrrell, Brian M. Wey, James R. Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 µm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 µm have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology. 2010-09-07T17:45:15Z 2010-09-07T17:45:15Z 2010-01 Article http://purl.org/eprint/type/JournalArticle 0277-786X http://hdl.handle.net/1721.1/58475 Brown, Matthew G. et al. “Digital-pixel focal plane array development.” Quantum Sensing and Nanophotonic Devices VII. Ed. Manijeh Razeghi, Rengarajan Sudharsanan, & Gail J. Brown. San Francisco, California, USA: SPIE, 2010. 76082H-10. ©2010 SPIE--The International Society for Optical Engineering. en_US http://dx.doi.org/10.1117/12.838314 Quantum Sensing and Nanophotonic Devices VII Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. application/pdf Society of Photo-optical Instrumentation Engineers SPIE |
| spellingShingle | Brown, Matthew G. Baker, Justin J. Colonero, Curtis B. Costa, Joseph S. Gardner, Thomas D. Kelly, Michael W. Schultz, Kenneth I. Tyrrell, Brian M. Wey, James R. Digital-pixel focal plane array development |
| title | Digital-pixel focal plane array development |
| title_full | Digital-pixel focal plane array development |
| title_fullStr | Digital-pixel focal plane array development |
| title_full_unstemmed | Digital-pixel focal plane array development |
| title_short | Digital-pixel focal plane array development |
| title_sort | digital pixel focal plane array development |
| url | http://hdl.handle.net/1721.1/58475 |
| work_keys_str_mv | AT brownmatthewg digitalpixelfocalplanearraydevelopment AT bakerjustinj digitalpixelfocalplanearraydevelopment AT colonerocurtisb digitalpixelfocalplanearraydevelopment AT costajosephs digitalpixelfocalplanearraydevelopment AT gardnerthomasd digitalpixelfocalplanearraydevelopment AT kellymichaelw digitalpixelfocalplanearraydevelopment AT schultzkennethi digitalpixelfocalplanearraydevelopment AT tyrrellbrianm digitalpixelfocalplanearraydevelopment AT weyjamesr digitalpixelfocalplanearraydevelopment |